MT18VDDF12872G-40BF1 Micron Technology Inc, MT18VDDF12872G-40BF1 Datasheet - Page 16
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MT18VDDF12872G-40BF1
Manufacturer Part Number
MT18VDDF12872G-40BF1
Description
MODULE DDR SDRAM 1GB 184-DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT18VDDF12872Y-40BF1.pdf
(31 pages)
Specifications of MT18VDDF12872G-40BF1
Memory Type
DDR SDRAM
Memory Size
1GB
Speed
400MT/s
Package / Case
184-DIMM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Table 13: Capacitance
Note: 11; notes appear on pages 18–20
Table 14: DDR SDRAM Component Electrical Characteristics and Recommended AC
Notes: 1–5, 12-15, 29; notes appear on pages 18–20; 0°C
pdf: 09005aef80f6b913, source: 09005aef80f6b41c
DDAF18C64_128x72G.fm - Rev. C 9/04 EN
AC CHARACTERISTICS
PARAMETER
Access window of DQs from CK/CK#
CK high-level width
CK low-level width
Clock cycle time
DQ and DM input hold time relative to DQS
DQ and DM input setup time relative to DQS
DQ and DM input pulse width (for each input)
Access window of DQS from CK/CK#
DQS input high pulse width
DQS input low pulse width
DQS-DQ skew, DQS to last DQ valid, per group, per access
Write command to first DQS latching transition
DQS falling edge to CK rising - setup time
DQS falling edge from CK rising - hold time
Half clock period
Data-out high-impedance window from CK/CK#
Data-out low-impedance window from CK/CK#
Address and control input hold time (fast slew rate)
Address and control input setup time (fast slew rate)
Address and control input hold time (slow slew rate)
Address and control input setup time (slow slew rate)
Address and Control input pulse width (for each input)
LOAD MODE REGISTER command cycle time
DQ-DQS hold, DQS to first DQ to go non-valid, per access
Data hold skew factor
ACTIVE to PRECHARGE command
ACTIVE to READ with Auto precharge command
ACTIVE to ACTIVE/AUTO REFRESH command period
AUTO REFRESH command period
PARAMETER
Input/Output Capacitance: DQ, DQS
Input Capacitance: Command and Address, S#, CKE
Input Capacitance: CK, CK#
Operating Conditions
CL = 3
CL = 2.5
CL = 2
T
A
16
512MB, 1GB (x72, ECC, SR) PC3200
+70°C; V
SYMBOL
t
t
CK (2.5)
t
t
t
t
DQSCK
t
t
t
t
CK (3)
CK (2)
DQSH
DQSQ
t
t
DIPW
DQSL
DQSS
t
t
t
t
t
MRD
t
t
t
t
DSH
t
t
QHS
t
t
t
IPW
RAS
RAP
t
t
DSS
t
t
t
RFC
DH
QH
AC
CH
HP
HZ
IH
IH
DS
RC
CL
LZ
IS
IS
Micron Technology, Inc., reserves the right to change products or specifications without notice.
F
S
F
S
DD
184-PIN DDR SDRAM RDIMM
= V
DD
SYMBOL
t
CH,
-
10.00
Q = +2.6V ±0.1V
-0.70
-0.60
-0.70
MIN
0.45
0.45
0.40
0.40
1.75
0.35
0.35
0.72
0.20
0.60
0.60
0.60
0.60
2.20
t
5.00
6.00
7.50
0.20
t
QHS
C
C
C
40
15
55
70
HP
I0
I1
I2
t
CL
-40B
70,000
+0.70
+0.60
+0.70
MAX
13.00
13.00
0.55
0.55
7.50
0.40
1.28
0.50
©2004 Micron Technology, Inc. All rights reserved.
MIN
2.5
4
2
UNITS
MAX
t
t
t
t
t
t
t
3.5
ns
CK
CK
ns
ns
ns
ns
ns
ns
CK
CK
ns
CK
CK
CK
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
3
UNITS
NOTES
40, 46
40, 46
40, 46
23, 27
23, 27
22, 23
16, 37
16, 37
22, 23
pF
pF
pF
26
26
27
30
12
12
12
12
31
44