MT9HVF3272PKY-667B1 Micron Technology Inc, MT9HVF3272PKY-667B1 Datasheet - Page 8
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MT9HVF3272PKY-667B1
Manufacturer Part Number
MT9HVF3272PKY-667B1
Description
MODULE DDR2 256MB 244MDIMM VLP
Manufacturer
Micron Technology Inc
Datasheet
1.MT9HVF12872KY-53EA1.pdf
(17 pages)
Specifications of MT9HVF3272PKY-667B1
Memory Type
DDR2 SDRAM
Memory Size
256MB
Speed
667MT/s
Package / Case
244-MDIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Electrical Specifications
Table 7:
Input Capacitance
Component AC Operating Specifications
Table 8:
PDF: 09005aef81c9620b/Source: 09005aef81c961ec
HVF9C64_128x72K.fm - Rev. C 3/07 EN
V
V
Symbol
DD
IN
I
VREF
, V
T
I
/V
T
OZ
I
C
A
I
1
DD
OUT
Q
Module and Component Speed Grades
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
V
test = 0V)
Output leakage current; 0V ≤ V
ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
Absolute Maximum Ratings
REF
REF
DD
/V
Module Speed Grade
Notes:
input 0V ≤ V
leakage current; V
DD
Q supply voltage relative to V
2
Stresses greater than those listed in Table 7 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in each device’s data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
1. Refresh rate is required to double when 85°C < T
2. For further information, refer to technical note
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades as shown in Table 8.
-80E
-800
-667
-53E
-40E
on Micron’s Web site.
IN
≤ 0.95V (All other pins not under
REF
= valid V
512MB, 1GB: (x72, ECC, SR) 244-Pin DDR2 VLP Mini-RDIMM
OUT
SS
≤ V
REF
SS
DD
level
IN
Q; DQs and
≤ V
DD
8
;
Commercial
Command/address
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
CK, CK#
DM
DQ, DQS, DQS#
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
TN-00-08: Thermal
C
≤ 95°C.
Electrical Specifications
-25E
-37E
-25
-5E
-3
–250
Min
–0.5
–0.5
©2005 Micron Technology, Inc. All rights reserved.
–18
–40
–40
–5
–5
–5
0
0
Applications, available
+250
Max
+2.3
+2.3
+18
+70
+85
+85
+95
+5
+5
+5
Units
µA
µA
µA
°C
°C
°C
°C
V
V