MT9HTF6472FY-667B4E3 Micron Technology Inc, MT9HTF6472FY-667B4E3 Datasheet - Page 2
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MT9HTF6472FY-667B4E3
Manufacturer Part Number
MT9HTF6472FY-667B4E3
Description
MODULE DDR2 512MB 240FBDIMM
Manufacturer
Micron Technology Inc
Specifications of MT9HTF6472FY-667B4E3
Memory Type
DDR2 SDRAM
Memory Size
512MB
Speed
667MT/s
Package / Case
240-FBDIMM
Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240FBDIMM
Device Core Size
72b
Organization
64Mx72
Total Density
512MByte
Chip Density
512Mb
Package Type
FBDIMM
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Number Of Elements
9
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 1: Key Timing Parameters
Table 2: Addressing
Table 3: Part Numbers and Timing Parameters – 512MB
Base device: MT47H64M8,
Table 4: Part Numbers and Timing Parameters – 1GB
Base device: MT47H128M8,
PDF: 09005aef81a2f1eb
htf9c64_128x72fy.pdf - Rev. C 12/09 EN
Parameter
Refresh count
Device bank address
Device configuration
Row address
Column address
Module rank address
MT9HTF6472FY-80E__
MT9HTF6472FY-667__
MT9HTF6472FY-53E__
MT9HTF12872FY-80E__
MT9HTF12872FY-667__
MT9HTF12872FY-53E__
Speed
Grade
Notes:
-80E
-667
-53E
Part Number
Part Number
1. The data sheet for the base device can be found on Micron’s Web site.
2. All part numbers end with a four-place code (not shown) that designates component, PCB, and AMB revi-
sions. Consult factory for current revision codes. Example: MT9HTF12872FY-667E1D4.
Nomenclature
Industry
PC2-6400
PC2-5300
PC2-4200
2
2
1
1
512Mb DDR2 SDRAM
Module
Density
Module
Density
1Gb DDR2 SDRAM
512MB
512MB
512MB
1GB
1GB
1GB
Configuration
Configuration
CL = 5
128 Meg x 72
128 Meg x 72
128 Meg x 72
64 Meg x 72
64 Meg x 72
64 Meg x 72
800
667
–
512MB, 1GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM
Data Rate (MT/s)
512Mb (64 Meg x 8)
16K A[13:0]
1K A[9:0]
4 BA[1:0]
512MB
CL = 4
1 S0#
Bandwidth
Bandwidth
533
533
533
8K
Module
Module
2
6.4 GB/s
5.3 GB/s
4.3 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
Micron Technology, Inc. reserves the right to change products or specifications without notice.
CL = 3
Memory Clock/
Memory Clock/
400
400
3.75ns/533 MT/s
3.75ns/533 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
–
Data Rate
Data Rate
t
RCD (ns)
12.5
15
15
(CL-
(CL-
Clock Cycles
Clock Cycles
1Gb (128 Meg x 8)
© 2005 Micron Technology, Inc. All rights reserved.
t
t
5-5-5
5-5-5
4-4-4
5-5-5
5-5-5
4-4-4
RCD-
RCD-
16K A[13:0]
t
1K A[9:0]
RP (ns)
8 BA[2:0]
12.5
1 S0#
15
15
t
t
1GB
RP)
RP)
8K
Link Transfer
Link Transfer
Features
4.8 GT/s
4.0 GT/s
3.2 GT/s
4.8 GT/s
4.0 GT/s
3.2 GT/s
t
RC (ns)
Rate
Rate
55
55
55