MT5HTF6472PKY-667A2 Micron Technology Inc, MT5HTF6472PKY-667A2 Datasheet
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MT5HTF6472PKY-667A2
Specifications of MT5HTF6472PKY-667A2
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MT5HTF6472PKY-667A2 Summary of contents
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DDR2 SDRAM Mini-RDIMM MT5HTF3272(P)K – 256MB For component data sheets, refer to Micron’s Web site: Features • 244-pin, mini-registered dual in-line memory module (mini-RDIMM) • Fast data transfer rates: PC-3200, PC2-4200, or PC2-5300 • Supports ECC error detection and correction ...
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Table 2: Addressing Refresh count Row addressing Device bank addressing Device page size per bank Device configuration Column addressing Module rank addressing Table 3: Part Numbers and Timing Parameters – 256MB Base device: MT47H32M16 Module 2 Part Number Density 256MB ...
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Pin Assignments and Descriptions Table 4: Pin Assignments 244-Pin Mini-RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol REF DQ24 DQ0 34 DQ25 65 4 DQ1 35 ...
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Table 5: Pin Descriptions Symbol Type ODT0 Input On-die termination: ODT (registered HIGH) enables termination resistance internal to the (SSTL_18) DDR2 SDRAM. When enabled, ODT is only applied to each of the following pins: DQ, DQS, DQS#, RDQS, RDQS#, CB, ...
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Table 5: Pin Descriptions (continued) Symbol Type V Supply Ground Supply Serial EEPROM positive power supply: +1.7V to +3.6V. DDSPD NC – No connect: These pins should be left unconnected. RFU – Reserved for future use. PDF: 09005aef818e3e75/Source: ...
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Functional Block Diagram Figure 2: Functional Block Diagram RS0# DQS0 DQS0# DM0 DQS1 DQS1# DM1 DQS2 DQS2# DM2 DQS3 DQS3# DM3 CK0 CK0# SCL S0# E BA0–BA1/BA2 G A0–A12 I RAS# CAS# S WE# ...
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... READs and by the memory controller during WRITEs. DQS is edge- aligned with data for READs and center-aligned with data for WRITEs. DDR2 SDRAM modules operate from a differential clock (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. ...
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... Simulations are significantly more accurate and realistic than a gross estimation of module capacitance when inductance and delay parameters associated with trace lengths are used in simulations. JEDEC modules are currently designed using simulations to close timing budgets. Component AC Timing and Operating Conditions Recommended AC operating conditions are given in the DDR2 component data sheets. Component specifications are available on Micron’ ...
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I Specifications DD Table 8: DDR2 I Specifications and Conditions – 256MB DD Values shown for MT47H32M16 DDR2 SDRAM only and are computed from values specified in the 512Mb (32 Meg x 16) component data sheet Parameter/Condition Operating one bank ...
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Register and PLL Specifications Table 9: Register Specifications SSTU32866 devices or equivalent JESD82-10 Parameter Symbol DC high-level input voltage DC low-level input voltage high-level IH AC ...
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Table 10: PLL Specifications CU877 device or equivalent JESD82-8.01 Parameter Symbol DC high-level input voltage V DC low-level input voltage V V Input voltage (limits high-level input voltage DC low-level input voltage V Input differential-pair cross V voltage ...
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Serial Presence-Detect Table 12: Serial Presence-Detect EEPROM DC Operating Conditions All voltages referenced to V Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input ...
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Table 14: Serial Presence-Detect Matrix Byte 0 Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on SDRAM 4 Number of column addresses on SDRAM ...
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Table 14: Serial Presence-Detect Matrix (continued) Byte 32 Address and command setup time, 33 Address and command hold time, 34 Data/data mask input setup time, 35 Data/data mask input hold time Write recovery time WRITE-to-READ command ...
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Module Dimensions Figure 3: 244-Pin DDR2 Mini-RDIMM 2.0 (0.079 1.0 (0.039 1.80 (0.071 6.0 (0.236) TYP 1.0 (0.039) 0.60 (0.024) TYP PIN 1 TYP 2.0 (0.079) TYP 42.9 (1.689) TYP No DRAM devices ...