MT4VDDT1664HY-335F3 Micron Technology Inc, MT4VDDT1664HY-335F3 Datasheet - Page 2

• Manufacturer Part Number: MT4VDDT1664HY-335F3
• Description: MODULE DDR 128MB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT4VDDT1664HY-335F3

• Memory Type: DDR SDRAM
• Memory Size: 128MB
• Speed: 200MHz
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 16Mx64
• Total Density: 128MByte
• Chip Density: 256Mb
• Access Time (max): 700ps
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 880mA
• Number Of Elements: 4
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1344

Table 2:
Table 3:
Table 4:
PDF: 09005aef837131bb/Source: 09005aef8086ea0b
dd4c16_32x64h.fm - Rev. E 10/08 EN
Parameter
Part Number
Part Number
Refresh count
Row address
Device bank address
Device configuration
Column address
Module rank address
MT4VDDT1664HG-40B__
MT4VDDT1664HY-40B__
MT4VDDT1664HG-335__
MT4VDDT1664HY-335__
MT4VDDT1664HG-26A__
MT4VDDT1664HG-265__
MT4VDDT1664HY-265__
MT4VDDT3264HG-40B__
MT4VDDT3264HY-40B__
MT4VDDT3264HG-335__
MT4VDDT3264HY-335__
MT4VDDT3264HG-265__
Addressing
Part Numbers and Timing Parameters – 128MB Modules
Base device: MT46V16M16,
Part Numbers and Timing Parameters – 256MB Modules
Base device: MT46V32M16,
2
2
Notes:
1. The data sheets for the base devices can be found on Micron’s Web site.
2. All part numbers end with a two-place code (not shown) that designates component and
PCB revisions. Consult factory for current revision codes. Example: MT4VDDT3264HY-40BF2.
Module
Density
Module
Density
128MB
128MB
128MB
128MB
128MB
128MB
128MB
256MB
256MB
256MB
256MB
256MB
1
1
256Mb DDR SDRAM
512Mb DDR SDRAM
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Configuration
Configuration
16 Meg x 64
16 Meg x 64
32 Meg x 64
32 Meg x 64
16 Meg x 64
16 Meg x 64
16 Meg x 64
16 Meg x 64
16 Meg x 64
32 Meg x 64
32 Meg x 64
32 Meg x 64
2
256Mb (16 Meg x 16)
8K (A0–A12)
4 (BA0, BA1)
512 (A0–A8)
Bandwidth
Bandwidth
Module
Module
128MB
3.2 GB/s
3.2 GB/s
2.7 GB/s
2.7 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
3.2 GB/s
3.2 GB/s
2.7 GB/s
2.7 GB/s
2.1 GB/s
1 (S0#)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
8K
Memory Clock/
Memory Clock/
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
5ns/400 MT/s
5ns/400 MT/s
6ns/333 MT/s
6ns/333 MT/s
5ns/400 MT/s
5ns/400 MT/s
6ns/333 MT/s
6ns/333 MT/s
Data Rate
Data Rate
©2003 Micron Technology, Inc. All rights reserved.
512Mb (32 Meg x 16)
8K (A0–A12)
4 (BA0, BA1)
1K (A0–A9)
256MB
1 (S0#)
8K
Clock Latency
Clock Latency
(CL-
(CL-
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
2.5-3-3
t
t
3-3-3
3-3-3
2-3-3
3-3-3
3-3-3
RCD-
RCD-
Features
t
t
RP)
RP)