MD1665-D2048-J SanDisk, MD1665-D2048-J Datasheet - Page 13

• Manufacturer Part Number: MD1665-D2048-J
• Description: UDOC FLASH DISK 2GB
• Manufacturer: SanDisk
• Type: Flash Diskr

Specifications of MD1665-D2048-J

• Memory Type: FLASH - Nand
• Memory Size: 2GB
• Package / Case: Module
• Density: 2GByte
• Operating Supply Voltage (typ): 5V
• Operating Temperature (min): 0C
• Operating Temperature (max): 70C
• Package Type: Not Required
• Pin Count: 10
• Operating Temperature Classification: Commercial
• Operating Supply Voltage (min): 4.4V
• Operating Supply Voltage (max): 5.25V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Speed: -
• Lead Free Status / Rohs Status: Not Compliant

5.
5.1
uDiskOnChip complies with CE requirements and FCC standards, and has been approved by the
UL organization.
uDiskOnChip is also available in lead-free versions (all configurations), which comply with the
RoHS directive.
5.2
5.2.1
Operating
Commercial: 0ºC to +70ºC
Extended: -40ºC to +85ºC
Storage
Extended: -55ºC to +95ºC
5.2.2
5.2.3
The reliability figure of merit most often used for electronic equipment is Mean Time Between
Failures (MTBF). M-Systems estimates MTBF using a prediction methodology based on reliability
data for the individual components in M-Systems products.
Component data comes from several sources: device life tests, failure analysis of earlier equipment,
device physics, and field returns. M-Systems uses following methods to predict reliability:
•
•
Table 3 summarizes the MTBF prediction results for various uDiskOnChip configurations. The
analysis was performed using a RAM Commander™ failure rate prediction.
•
13
Vibration
Mechanical Shock
Reliability Test
Telcordia Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment
(RPP).
British Telecom Industry HRD5, Handbook of Reliability Data for Electronic Components
used in Telecommunication System.
Failure Rate: The total number of failures within an item population, divided by the total
number of life units expended by that population, during a particular measurement interval
under stated condition.
S
Standards Compliance
Environmental
Temperature
Shock and Vibration
Mean Time Between Failures (MTBF)
PECIFICATIONS
10 Hz to 500 Hz, 5 g, 3 axes, 30 minutes
Duration: 11 ms, 50 g, 3 axes, 18 times
Table 2: Shock/Vibration Testing for uDiskOnChip
uDiskOnChip Data Sheet, Rev. 2.2
Test Conditions
Reference Standards
IEC 68-2-27
IEC 68-2-6
94-SR-003-01-8L