HDSM-531B Avago Technologies US Inc., HDSM-531B Datasheet - Page 5

• Manufacturer Part Number: HDSM-531B
• Description: DISPLAY 1DIGIT BLU CA 0.56"
• Manufacturer: Avago Technologies US Inc.
• Type: Moduler

Specifications of HDSM-531B

• Number Of Digits/alpha: 1
• Size / Dimension: 0.75" L x 0.49" W x 0.15" H (19.00mm x 12.50mm x 3.75mm)
• Digit/alpha Size: 0.56" (14.22mm)
• Display Type: 7-Segment
• Common Pin: Common Anode
• Color: Blue
• Voltage - Forward (vf) Typ: 3.3V
• Current - Test: 10mA
• Millicandela Rating: 13.5mcd
• Wavelength - Peak: 462nm
• Power Dissipation (max): 100mW
• Package / Case: 10-SMD
• No. Of Digits / Alpha: 1
• Character Size: 14mm
• Led Color: Blue
• Common Connection: Common Anode
• Luminous Intensity: 13.5mcd
• Forward Current If: 20mA
• Forward Voltage: 3.3V
• Forward Voltage At If: 3.3V
• Number Of Digits: 1
• Package Type: SMD
• Product Length (mm): 12.5mm
• Product Height (mm): 3.75mm
• Product Depth (mm): 19mm
• Digit Size (in): .56in
• Character Displayed: Numeric
• Viewing Area Length (mm): 8.1mm
• Viewing Area Height (mm): 14.22mm
• Emitting Color: Blue
• Test Current (it): 10mA
• Forward Current: 25mA
• Dominant Wave Length: 470nm
• Power Dissipation: 100mW
• Total Thickness: 3.15mm
• Reverse Voltage: 5V
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Pin Count: 10
• Configuration: Common Anode
• Number Of Elements: 8
• Peak Wavelength: 462nm
• Reverse Current: 100uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Intensity Bin Limit (mcd)
Blue
Tolerance +/-15%
Note:
1. Bin categories are established for classification of products. Products
SMT Soldering Profile
Pb free reflow soldering Profile
Notes:
1. The peak temperature refers to the peak package body temperature.
2. Number of reflow process shall be limited to maximum 2 times only.
5
Iv Bin Category
M
N
P
Q
may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
Cooling process to normal temperature is required between first and
second soldering process.
217°C
200°C
150°C
3°C/SEC. MAX.
3°C/SEC. MAX.
60 - 120 SEC.
245°C
Min
5.401
8.601
13.701
21.801
TIME
(Acc. to J-STD-020C)
10 - 30 SEC.
100 SEC. MAX.
6°C/SEC. MAX.
Max
8.600
13.700
21.800
34.700
Recommended Soldering Pattern (unit: mm)
Recommended stencil window opening is 80%
1.8
3
2.45 x 4 = 9.8
16