HDSM-543H Avago Technologies US Inc., HDSM-543H Datasheet - Page 8

DISPLAY 2DIGIT GRN CC 0.56"

HDSM-543H

Manufacturer Part Number
HDSM-543H
Description
DISPLAY 2DIGIT GRN CC 0.56"
Manufacturer
Avago Technologies US Inc.
Type
Panelr
Datasheet

Specifications of HDSM-543H

Number Of Digits/alpha
2
Size / Dimension
0.75" L x 0.98" W x 0.15" H (19.00mm x 25.00mm x 3.75mm)
Digit/alpha Size
0.56" (14.22mm)
Display Type
7-Segment
Common Pin
Common Cathode
Color
Green
Voltage - Forward (vf) Typ
2.1V
Current - Test
10mA
Millicandela Rating
10.5mcd
Wavelength - Peak
572nm
Power Dissipation (max)
65mW
Package / Case
10-SMD
No. Of Digits / Alpha
2
Character Size
14.22mm
Led Color
Green
Common Connection
Common Cathode
Luminous Intensity
10.5mcd
Forward Current If
20mA
Forward Voltage
2.1V
Number Of Digits
2
Illumination Color
Green
Operating Voltage
2.1 V
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Package Type
SMD
Product Length (mm)
25.1mm
Product Height (mm)
3.75mm
Product Depth (mm)
19mm
Digit Size (in)
.56in
Character Displayed
Numeric
Viewing Area Length (mm)
8.1mm
Viewing Area Height (mm)
14.22mm
Emitting Color
Green
Test Current (it)
10mA
Forward Current
25mA
Dominant Wave Length
571nm
Power Dissipation
65mW
Total Thickness
3.15mm
Reverse Voltage
5V
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Pin Count
10
Configuration
Common Cathode
Number Of Elements
16
Peak Wavelength
572nm
Reverse Current
100uA
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Intensity Bin Limits (mcd)
Green
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products.
SMT Soldering Profile
Pb free reflow soldering Profile
Notes:
1. The peak temperature refers to the peak package body
2. Number of reflow process shall be limited to maximum 2 times only.
8
IV Bin Category
M
N
P
Q
Products may not be available in all categories. Please contact your
Avago representative for information on currently available bins.
temperature.
Cooling process to normal temperature is required between first
and second soldering process.
217°C
200°C
150°C
3°C/SEC. MAX.
3°C/SEC. MAX.
60 - 120 SEC.
Min.
5.401
8.601
21.801
13.701
245°C
TIME
(Acc. to J-STD-020C)
10 - 30 SEC.
100 SEC. MAX.
Max
8.600
13.700
21.800
34.700
6°C/SEC. MAX.
Yellow / Red / Orange
Tolerance: ±15%
Recommended soldering pattern (unit: mm)
IV Bin Category
N
P
Q
R
Recommended stencil window opening is 80%
2
3
2.54 x 4 = 10.16
Min.
8.601
13.701
21.801
34.701
16
Max
13.700
21.800
34.700
55.200

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