SCDV5544 OSRAM Opto Semiconductors Inc, SCDV5544 Datasheet - Page 10

• Manufacturer Part Number: SCDV5544
• Description: DISPLAY 4CHAR .123" 5X5 HEG DIP
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: Intelligent Display®r

Specifications of SCDV5544

• Millicandela Rating: 6.4mcd
• Size / Dimension: 0.78" L x 0.40" W x 0.20" H (19.91mm x 10.16mm x 5.08mm)
• Color: Green
• Configuration: 5 x 5
• Number Of Digits: 4
• Character Size: 0.123 in
• Illumination Color: High Efficiency Green
• Wavelength: 568 nm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Luminous Intensity: 6.4 mcd
• Viewing Area (w X H): 2.41 mm x 3.41 mm
• Display Type: 5 x 7 Dot Matrix
• Emitting Color: Hi-Eff. Green
• Digit Size (in): .123in
• Viewing Area Height (mm): 3.124mm
• Package Type: DIP
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 85C
• Mounting: Through Hole
• Pin Count: 11
• Total Thickness (mm): 5.08mm
• Opto Display Type: Panel
• Pattern Type: Dot Matrix
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Forward (vf) Typ: -
• Internal Connection: -
• Lead Free Status / Rohs Status: Compliant
• Other names: Q68000A8894

Row Strobing
Multiplexer and Display Driver
The four characters are row multiplexed with RAM resident column
data. The strobe rate is established by the internal or external
MUX Clock rate. The MUX Clock frequency is divided by a 320
counter chain. This results in a typical strobe rate of 750 Hz. By
pulling the Clock SEL line low, the display can be operated from an
external MUX Clock. The external clock is attached to the CLK I/O
connection (pin 8). The maximum external MUX Clock frequency
should be limited to 1.0 MHz.
An asynchronous hardware Reset Pin is also provided. Bringing
this pin low will clear the Character Address Register, Control
Word Register, RAM, and blanks the display. This action leaves the
display set at Character Address 0, and the Brightness Level set at
100%.
Electrical & Mechanical Considerations
Interconnect Considerations
Optimum product performance can be had when the following
electrical and mechanical recommendations are adopted. The
SCDV554X’s IC is constructed in a high speed CMOS process,
consequently high speed noise on the SERIAL DATA, SERIAL
DATA CLOCK, LOAD and RESET lines may cause incorrect data
to be written into the serial shift register. Adhere to transmission
line termination procedures when using fast line drivers and long
cables (> 10 cm).
Good digital grounds (pins 7 and 14) and power supply decoupling
(pins 10, 11 and 12) will insure that I
currents do not generate localized ground bounce. Therefore it is
recommended that each display package use a 0.1 µF and 20 µF
capacitor between V
When the internal MUX Clock is being used connect the CLKSEL
pin to V
nected to the system’s reset control, it is recommended that this
pin be connected to the center node of a series 0.1 µF and 100 kΩ
RC network. Thus upon initial power up the RESET will be held
low for 10 ms allowing adequate time for the system power supply
to stabilize.
2006-01-23
CC
. In those applications where RESET will not be con-
Row
Load
Row 0
Row 1
Row 2
Row 3
Row 4
CC
and ground.
0 1 2 3 4
Load Row 0
Columns
SCDV5540, SCDV5541, SCDV5542, SCDV5543, SCDV5544
CC
Row 0
Row 1
Row 2
Row 3
Row 4
(< 400 mA peak) switching
0
Load Row 1
Columns
1
2 3
4
Row 0
Row 1
Row 2
Row 3
Row 4
10
0
Load Row 2
Columns
ESD Protection
The input protection structure of the SCDV554X provides signifi-
cant protection against ESD damage. It is capable of withstanding
discharges greater than 2.0 kV. Take all the standard precautions,
normal for CMOS components. These include properly grounding
personnel, tools, tables, and transport carriers that come in contact
with unshielded parts. If these conditions are not, or cannot be
met, keep the leads of the device shorted together or the parts in
anti-static packaging.
Soldering Considerations
The SCDV554X can be hand soldered with SN63 solder using a
grounded iron set to 260°C.
Wave soldering is also possible following these conditions: Pre-
heat that does not exceed 93°C on the solder side of the PC board
or a package surface temperature of 85°C. Water soluble organic
acid flux (except carboxylic acid) or rosin-based RMA flux without
alcohol can be used.
Wave temperature of 245°C ± 5°C with a dwell between 1.5 sec. to
3.0 sec. Exposure to the wave should not exceed temperatures
above 260°C for five seconds at 1.59 mm (0.063") below the seat-
ing plane. The packages should not be immersed in the wave.
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60 °C) for
less than 15 minutes. Addition of mild saponifiers is acceptable. Do
not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Exercise care in choos-
ing solvents as some may chemically attack the nylon package. For
further information refer to Appnotes 18 and 19 at
www.osram-os.com
An alternative to soldering and cleaning the display modules is to
use sockets. Naturally, 14 pin DIP sockets 7.62 mm (0.300") wide
with 2.54 mm (0.100") centers work well for single displays. Multi-
ple display assemblies are best handled by longer SIP sockets or
DIP sockets when available for uniform package alignment. Socket
manufacturers are Aries Electronics, Inc., Frenchtown, NJ; Garry
Manufacturing, New Brunswick, NJ; Robinson-Nugent, New
Albany, IN; and Samtec Electronic Hardward, New Albany, IN.
For further information refer to Appnote 22 at www.osram-os.com
1
2
3
4
Row 0
Row 1
Row 2
Row 3
Row 4
0
Load Row 3
Columns
1
2
3 4
Row 0
Row 1
Row 2
Row 3
Row 4
0 1 2
Load Row 4
Columns
IDXX5186
3
4