SFH 4655-Z OSRAM Opto Semiconductors Inc, SFH 4655-Z Datasheet - Page 8
![EMITTER 850NM MIDLED SIDELK SMD](/photos/8/0/80044/sfh_4655-z_sml.jpg)
SFH 4655-Z
Manufacturer Part Number
SFH 4655-Z
Description
EMITTER 850NM MIDLED SIDELK SMD
Manufacturer
OSRAM Opto Semiconductors Inc
Datasheet
1.SFH_4655-Z.pdf
(9 pages)
Specifications of SFH 4655-Z
Wavelength
850nm
Package / Case
Non-Standard SMD
Current - Dc Forward (if)
100mA
Radiant Intensity (ie) Min @ If
16mW/sr @ 100mA
Voltage - Forward (vf) Typ
1.5V
Viewing Angle
30°
Orientation
Side View
Mounting Type
Surface Mount
Beam Angle
20 deg
Radiant Intensity
50 mW/sr
Maximum Forward Current
100 mA
Maximum Power Dissipation
180 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Fall Time
12 ns
Lens Shape
Circular
Mounting Style
SMD/SMT
Operating Voltage
1.5 V
Rise Time
12 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
475-1260-2
Q65110A1569
SFH 4655-Z
Q65110A1569
SFH 4655-Z
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Maße in mm / Dimensions in mm.
Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der
Handling indication:
2009-10-16
SFH 4650
SFH 4655
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for improved
heat dissipation
Cu-Fläche > 16 mm
Cu-area
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for improved
heat dissipation
Cu-Fläche > 16 mm
Cu-area
Lötstopplack
Solder resist
Lötstopplack
Solder resist
Bauteiloberfläche sollte so gering wie möglich gehalten werden.
The package is casted with silicone. Mechanical stress at the surface of
the unit should be as low as possible.
2
2
8
SFH 4650, SFH 4655
1.7
2.4
OHF02421
OHF02422