HSMA-C190 Avago Technologies US Inc., HSMA-C190 Datasheet - Page 7

• Manufacturer Part Number: HSMA-C190
• Description: LED 595NM AMB DIFF 0603 SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HSMA-C190

• Package / Case: 0603 (1608 Metric)
• Viewing Angle: 170°
• Color: Amber
• Millicandela Rating: 90mcd
• Current - Test: 20mA
• Wavelength - Dominant: 592nm
• Wavelength - Peak: 595nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Diffused
• Lens Style/size: Rectangle, 1mm x 0.8mm
• Size / Dimension: 1.60mm L x 0.80mm W
• Height: 0.80mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 592nm
• Led Size: 0603
• Illumination Color: Amber
• Lens Color/style: Untinted Diffused
• Operating Voltage: 1.9 V
• Wavelength: 592 nm
• Luminous Intensity: 90 mcd
• Mounting Style: SMD/SMT
• Operating Current: 20 mA
• Lens Shape: Rectangular
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Package Type: Chip Led
• Emitting Color: Amber
• Test Current (it): 20mA
• Forward Current: 25mA
• Dominant Wave Length: 592nm
• Forward Voltage: 2.4V
• Product Length (mm): 1.6mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Mounting: Surface Mount
• Peak Wavelength: 595nm
• Shape Type: Rectangular
• Chip Material: AlGaInP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 85C
• Reverse Voltage: 5V
• Power Dissipation: 60mW
• Lens Dimensions: 1x0.8x0.5mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1423-2

Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
Figure 7. Recommended reflow soldering profile.
Figure 9. Recommended soldering pattern for HSMx-C110.
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Note: All dimensions in millimeters (inches).
7
(0.031)
0.9 (0.035)
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.8
0.2 (0.008)
0
-90
140-160°C
-80
OVER 2 MIN.
(0.028)
-70
4°C/SEC.
0.7
MAX.
10 SEC. MAX.
-60
(0.059)
230°C MAX.
1.5
-50
TIME
(0.031)
-40
5.0 (0.200)
0.8
0.8 (0.031)
(0.079)
-30
2.0
4°C/SEC. MAX.
-20
0.9 (0.035)
-10
(0.059)
ANGLE
1.5
0
–3°C/SEC.
10
20 30
CENTERING
BOARD
1.0 (0.039)
40
50
60
70
80
Figure 8. Recommended Pb-free reflow soldering profile.
Figure 10. Recommended soldering pattern for HSMx-C170.
Figure 12. Recommended soldering pattern for HSMx-C150.
90
(0.047)
(0.059)
1.2
1.5
217 °C
200 °C
150 °C
(0.035)
0.9
(0.079)
(0.047)
2.0
3 °C/SEC. MAX.
1.2
3 °C/SEC. MAX.
60 - 120 SEC.
255 - 260 °C
(0.059)
1.2 (0.047)
1.5
TIME
1.5 (0.059)
60 SEC. MAX.
10 SEC. MAX.
6 °C/SEC. MAX.