LTW-C191TS5 Lite-On Electronics, LTW-C191TS5 Datasheet - Page 9

• Manufacturer Part Number: LTW-C191TS5
• Description: LED WHITE YELLOW LENS 0603 SMD
• Manufacturer: Lite-On Electronics
• Type: Uni-Colorr

Specifications of LTW-C191TS5

• Led Size: 0603
• Illumination Color: White
• Operating Voltage: 2.7 V to 3.15 V
• Luminous Intensity: 28 mcd to 112 mcd
• Mounting Style: SMD/SMT
• Operating Current: 5 mA
• Lens Shape: Rectangular
• Maximum Operating Temperature: + 80 C
• Minimum Operating Temperature: - 20 C
• Package / Case: 0603 (1608 Metric)
• Viewing Angle: 130°
• Color: White
• Millicandela Rating: 112.5mcd
• Current - Test: 5mA
• Wavelength - Dominant: 8700K
• Voltage - Forward (vf) Typ: 2.93V
• Lens Type: Diffused, Yellow Tinted
• Lens Style/size: Rectangle, 1.1mm x 0.8mm
• Size / Dimension: 1.60mm L x 0.80mm W
• Height: 0.55mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 8700K
• Package Type: Chip Led
• Emitting Color: White
• Test Current (it): 5mA
• Forward Current: 20mA
• Color Coordinates: x=0.294/y=0.286
• Dominant Wave Length: Not Requirednm
• Forward Voltage: 3.15V
• Product Length (mm): 1.6mm
• Product Height (mm): 0.55mm
• Product Depth (mm): 0.8mm
• Mounting: Surface Mount
• Peak Wavelength: Not Requirednm
• Shape Type: Rectangular
• Chip Material: InGaN
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Commercial
• Operating Temp Range: -20C to 80C
• Reverse Voltage: 5V
• Power Dissipation: 70mW
• Lens Dimensions: 1.1X0.8X0.27mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Wavelength - Peak: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 160-1724-2

BNS-OD-C131/A4
Part No. : LTW-C191TS5
1. Application
2. Storage
3. Cleaning
4. Soldering
Soldering notes:
The package is sealed:
The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within
one year, while the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within 672hrs.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed
container with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than one week should be baked at about 60 deg C for at least
20 hours before solder assembly.
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance
for information on applications in which exceptional reliability is required, particularly when the failure
or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation,
traffic control equipment, medical and life support systems and safety devices).
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
Recommended soldering conditions:
Pre-heat
Pre-heat time
Peak temperature
Soldering time
Because different board designs use different number and types of devices, solder pastes, reflow ovens,
and circuit boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and
PCB-specific characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and
board-level assembly.
The results of this testing are verified through post-reflow reliability testing.
Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully
and reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards.
You can use this example as a generic target to set up your reflow process.
You should adhere to the JEDEC profile limits as well as specifications and recommendations from the
solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
Reflow soldering
LITE-ON TECHNOLOGY CORPORATION
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
P r o p e r t y o f L i t e - O n O n l y
CAUTIONS
Temperature
Soldering time
Soldering iron
Page :
300°C Max.
3 sec. Max.
(one time only)
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