LY E67B-U2AA-26-1-Z OSRAM Opto Semiconductors Inc, LY E67B-U2AA-26-1-Z Datasheet - Page 10

• Manufacturer Part Number: LY E67B-U2AA-26-1-Z
• Description: LED YELLOW 587NM CLR 4-PLCC SMD
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: TOPLEDr
• Type: Uni-Colorr

Specifications of LY E67B-U2AA-26-1-Z

• Package / Case: 4-PLCC
• Viewing Angle: 120°
• Color: Yellow
• Luminous Flux @ Current - Test: 2.95 lm
• Millicandela Rating: 980mcd
• Current - Test: 50mA
• Wavelength - Dominant: 587nm
• Wavelength - Peak: 594nm
• Voltage - Forward (vf) Typ: 2.2V
• Lens Type: Clear
• Lens Style/size: Round, 2.4mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 2.10mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 587nm
• Led Size: 2.4 mm X 2.4 mm X 0.9 mm
• Illumination Color: Yellow
• Operating Voltage: 2.5 V
• Wavelength: 587 nm
• Luminous Intensity: 1400 mcd (Max)
• Mounting Style: SMD/SMT
• Operating Current: 70 mA
• Lens Shape: Circular
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Peak Wavelength: 594 nm
• Package Type: PLCC
• Emitting Color: Amber
• Test Current (it): 50mA
• Forward Current: 70mA
• Dominant Wave Length: 587nm
• Luminous Flux: 2.95lm
• Forward Voltage: 2.5V
• Product Length (mm): 3mm
• Product Height (mm): 2mm
• Product Depth (mm): 3.4mm
• Mounting: Surface Mount
• Shape Type: Circular
• Chip Material: AlGaInP
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 4
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 12V
• Power Dissipation: 180mW
• Lens Dimensions: 2.4x2.4x0.9mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 475-1186-2; Q65110A2323

Empfohlenes Lötpaddesign verwendbar für TOPLED
IR Reflow Löten
Recommended Solder Pad useable for TOPLED
IR Reflow Soldering
Empfohlenes Lötpaddesign
Recommended Solder Pad
2005-04-05
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) Seite 15
8) page 15
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
6.1 (0.240)
0.7 (0.028)
8) page 15
8) Seite 15
0.8 (0.031)
2.8 (0.110)
Anode
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
3.3 (0.130)
Lötstoplack
Solder resist
10
®
Anode
LS E67B, LA E67B, LO E67B, LY E67B
and Power TOPLED
2.8 (0.110)
Wellenlöten (TTW)
TTW Soldering
®
Cu Fläche / 16 mm per pad
Cu-area
und Power TOPLED
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.5 (0.020)
<
_
2
Cu Fläche / > 16 mm per pad
Cu-area
®
Kathode/
Cathode
Kathode/
Cathode
Lötstoplack
Solder resist
®
OHLPY440
2
OHAY1583