LB T67C-P2R1-35-Z OSRAM Opto Semiconductors Inc, LB T67C-P2R1-35-Z Datasheet - Page 12

LED BLUE 470NM CLEAR 2-PLCC SMD

LB T67C-P2R1-35-Z

Manufacturer Part Number
LB T67C-P2R1-35-Z
Description
LED BLUE 470NM CLEAR 2-PLCC SMD
Manufacturer
OSRAM Opto Semiconductors Inc
Series
TOPLEDr
Type
Uni-Colorr

Specifications of LB T67C-P2R1-35-Z

Package / Case
2-PLCC
Viewing Angle
120°
Color
Blue
Luminous Flux @ Current - Test
300 mlm
Millicandela Rating
98mcd
Current - Test
20mA
Wavelength - Dominant
470nm
Wavelength - Peak
465nm
Voltage - Forward (vf) Typ
3.6V
Lens Type
Clear
Lens Style/size
Round, 2.4mm
Size / Dimension
3.20mm L x 2.80mm W
Height
2.10mm
Mounting Type
Surface Mount
Resistance Tolerance
470nm
Led Size
2.4 mm X 2.4 mm X 0.9 mm
Illumination Color
Blue
Operating Voltage
4.1 V
Wavelength
470 nm
Luminous Intensity
140 mcd (Max)
Mounting Style
SMD/SMT
Operating Current
20 mA
Lens Shape
Circular
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Peak Wavelength
465 nm
Package Type
PLCC
Emitting Color
Blue
Test Current (it)
20mA
Forward Current
20mA
Dominant Wave Length
470nm
Luminous Flux
0.29lm
Forward Voltage
4.1V
Product Length (mm)
3.4mm
Product Height (mm)
2mm
Product Depth (mm)
3mm
Mounting
Surface Mount
Shape Type
Circular
Chip Material
InGaN
Main Category
Chip LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-40C to 100C
Reverse Voltage
5V
Power Dissipation
85mW
Lens Dimensions
2.4x2.4x0.9mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
475-1135-2
Q65110A1857
Empfohlenes Lötpaddesign
Recommended Solder Pad
Empfohlenes Lötpaddesign verwendbar für TOPLED
IR Reflow Löten
Recommended Solder Pad useable for TOPLED
IR Reflow Soldering
2005-04-05
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
8) Seite 17
8) page 17
2.3 (0.091)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
0.7 (0.028)
8) 9) page 17
0.8 (0.031)
8) 9) Seite 17
2.6 (0.102)
Anode
3.3 (0.130)
Lötstoplack
Solder resist
IR Reflow Löten
IR Reflow Soldering
12
®
and Power TOPLED
Lötstopplack
Solder resist
®
Cu Fläche /
Cu-area
und Power TOPLED
2.6 (0.102)
3.3 (0.130)
Fläche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
<
_
LB T67C, LV T67C, LT T67C
Cu-Fläche > 16 mm
Cu-area > 16 mm
16 mm per pad
2
®
OHLPY970
Kathode/
Cathode
2
2
®
OHLPY440

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