HLMP-3316 Avago Technologies US Inc., HLMP-3316 Datasheet - Page 10

• Manufacturer Part Number: HLMP-3316
• Description: LED 5MM 635NM HE RED TINT
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HLMP-3316

• Viewing Angle: 35°
• Package / Case: Radial - 2 Lead
• Color: Red
• Millicandela Rating: 60mcd
• Current - Test: 10mA
• Wavelength - Dominant: 626nm
• Wavelength - Peak: 635nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Clear, Red Tinted
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 8.81mm
• Mounting Type: Through Hole
• Resistance Tolerance: 626nm
• Led Size: T-1 3/4
• Illumination Color: Red
• Lens Color/style: Non-Diffused
• Operating Voltage: 1.9 V
• Wavelength: 626 nm
• Luminous Intensity: 22 mcd
• Operating Current: 10 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Color, Emitted: Red
• Color, Lens: Clear
• Current, Forward: 25 mA
• Diameter: 0.24 in.
• Package Type: 5 mm (T-13⁄4)
• Power Dissipation: 135 mW
• Temperature, Operating, Maximum: +100 °C
• Temperature, Operating, Minimum: -55 °C
• Temperature, Soldering: 260 For 5 Sec.
• Voltage, Forward: 1.9 V
• Voltage, Reverse: 5 V (Max.) @ 100 μA Reverse
• Wavelength, Peak: 635 nm
• Emitting Color: Red
• Test Current (it): 10mA
• Forward Current: 30mA
• Dominant Wave Length: 626nm
• Forward Voltage: 2.4V
• Product Length (mm): 6.1mm
• Product Height (mm): 9.19mm
• Product Depth (mm): 6.1mm
• Mounting: Through Hole
• Peak Wavelength: 635nm
• Shape Type: Circular
• Chip Material: GaP
• Main Category: Standard LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1335

Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• It is recommended that tooling made to precisely
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is 1.59
• Recommended soldering conditions:
For product information and a complete list of distributors, please go to our website:
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4259EN
AV02-1023EN -
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
form and cut the leads to length rather than rely upon
hand operation.
process to prevent damage to LED component.
mm below the body (encapsulant epoxy) for those
parts without standoff.
Figure 17. Recommended wave soldering profile.
Pre-heat Temperature 105 °C Max.
Pre-heat Time
Peak Temperature
Dwell Time
250
200
150
100
50
30
0
October 13, 2008
10
FLUXING
TURBULENT WAVE
PREHEAT
20
30
TIME – SECONDS
40
Wave Soldering
30 sec Max.
250 °C Max.
3 sec Max.
50
60
70
LAMINAR WAVE
HOT AIR KNIFE
80
90
Manual Solder
Dipping
–
–
260 °C Max.
5 sec Max.
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
www.avagotech.com
• Wave soldering parameter must be set and maintained
• If necessary, use fixture to hold the LED component
• Proper handling is imperative to avoid excessive
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
in proper orientation with respect to the PCB during
soldering process.
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
for LED component leads:
Diagonal
0.646 mm
(0.025 inch) (0.038 to 0.042 inch)
0.718 mm
(0.028 inch) (0.041 to 0.045 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
1.049 to 1.150 mm