HLMP-1521-E0002 Avago Technologies US Inc., HLMP-1521-E0002 Datasheet - Page 9

• Manufacturer Part Number: HLMP-1521-E0002
• Description: LED 3MM GAP TINT GRN STR LEADS
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-1521-E0002

• Viewing Angle: 45°
• Package / Case: Radial - 2 Lead
• Color: Green
• Millicandela Rating: 22mcd
• Current - Test: 10mA
• Wavelength - Dominant: 569nm
• Wavelength - Peak: 565nm
• Voltage - Forward (vf) Typ: 2.1V
• Lens Type: Clear, Green Tinted
• Lens Style/size: Round, 3mm, T-1
• Height: 4.70mm
• Mounting Type: Through Hole
• Resistance Tolerance: 569nm
• Led Size: T-1
• Illumination Color: Green
• Wavelength: 569 nm
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• It is recommended that tooling made to precisely form
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is 1.59
• Recommended soldering conditions:
Figure 17. Recommended wave soldering profile.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4253EN
AV02-1068EN - October 13, 2008
Pre-heat Temperature 105°C Max.
Pre-heat Time
Peak Temperature
Dwell Time
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
and cut the leads to length rather than rely upon hand
operation.
process to prevent damage to LED component.
mm below the body (encapsulant epoxy) for those
parts without standoff.
250
200
150
100
50
30
0
10
FLUXING
20
PREHEAT
TURBULENT WAVE
30
Wave Soldering
30 sec Max.
250°C Max.
3 sec Max.
40
TIME – SECONDS
50
60
Manual Solder
Dipping
–
–
260°C Max.
5 sec Max.
70
LAMINAR WAVE
HOT AIR KNIFE
80
www.avagotech.com
90
• Wave soldering parameter must be set and maintained
• If necessary, use fixture to hold the LED component
• Proper handling is imperative to avoid excessive
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes for
100
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
in proper orientation with respect to the PCB during
soldering process.
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
Diagonal
0.646 mm
0.718 mm
Plated Through
Hole Diameter
0.976 to 1.078 mm
1.049 to 1.150 mm