LTL2H3SYK Lite-On Electronics, LTL2H3SYK Datasheet - Page 7

LED 5MM 594NM ALINGAP AMBER CLR

LTL2H3SYK

Manufacturer Part Number
LTL2H3SYK
Description
LED 5MM 594NM ALINGAP AMBER CLR
Manufacturer
Lite-On Electronics
Datasheet

Specifications of LTL2H3SYK

Viewing Angle
15°
Package / Case
Radial - 2 Lead
Color
Amber
Millicandela Rating
5500mcd
Current - Test
20mA
Wavelength - Dominant
590nm
Wavelength - Peak
591nm
Voltage - Forward (vf) Typ
2.35V
Lens Type
Clear
Lens Style/size
Round, 5mm, T-1 3/4
Height
8.70mm
Mounting Type
Through Hole
Resistance Tolerance
590nm
Led Size
T-1 3/4
Illumination Color
Amber
Lens Color/style
Water Clear
Operating Voltage
2.15 V
Wavelength
594 nm
Luminous Intensity
5500 mcd
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
160-1653

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTL2H3SYK
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL2H3SYK-0B2A
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL2H3SYKS
Manufacturer:
LITEON
Quantity:
40 000
Part Number:
LTL2H3SYKS-032A
Manufacturer:
LITEON
Quantity:
40 000
1. Application
2. Storage
3. Cleaning
4. Lead Forming & Assembly
5. Soldering
Part No. : LTL2H3SEK / LTL2H3SYK
BNS-OD-C131/A4
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
Recommended soldering conditions :
Temperature
Soldering time
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
Soldering iron
300°C Max.
3 sec. Max.
(one time only)
LITE-ON TECHNOLOGY CORPORATION
CAUTIONS
P r o p e r t y o f L i t e - O n O n l y
Pre-heat
Pre-heat time
Solder wave
Soldering time
Wave soldering
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
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