B32676E4156K EPCOS Inc, B32676E4156K Datasheet - Page 24

• Manufacturer Part Number: B32676E4156K
• Description: CAP 15UF 10% 450V METAL POLYPRO
• Manufacturer: EPCOS Inc
• Series: MKP B32676r

Specifications of B32676E4156K

• Capacitance: 15µF
• Tolerance: ±10%
• Lead Spacing: 1.476" (37.50mm)
• Voltage - Ac: 275V
• Voltage - Dc: 450V
• Dielectric Material: Polypropylene, Metallized
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 1.654" L x 1.102" W (42.00mm x 28.00mm)
• Height: 1.673" (42.50mm)
• Termination: PC Pins
• Features: AC and Pulse
• Voltage Rating: 450 Volts
• Esr: 4.1 mOhms
• Termination Style: Radial
• Dimensions: 28 mm W x 42 mm L x 42.5 mm H
• Operating Temperature Range: - 55 C to + 85 C
• Product: Metallized Polypropylene Capacitors
• Tolerance (+ Or -): 10%
• Temp Coeff (dielectric): PLYP
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Product Diameter (mm): Not Requiredmm
• Product Depth (mm): 28mm
• Lead Spacing (nom): 37.5mm
• Lead Diameter (nom): 1mm
• Operating Temp Range: -40C to 100C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Lead Free Status / Rohs Status: Compliant
• Other names: 495-2965; B32676E4156K000

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32674 ... B32678
MKP DC link
max
. Long exposure to temperatures above this type-related temperature limit
high power series
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