OVTL09LG3M TT Electronics/Optek Technology, OVTL09LG3M Datasheet - Page 11

• Manufacturer Part Number: OVTL09LG3M
• Description: LED RED/GRN/BLU 10W 29.15MM ARR
• Manufacturer: TT Electronics/Optek Technology

Specifications of OVTL09LG3M

• Color: Red, Green, Blue (RGB)
• Current - Test: 1.05A
• Luminous Flux @ Current - Test: 300lm
• Current - Max: 1.05A
• Lumens @ Current - Max: 300lm
• Lumens/watt @ Current - Test: 31lm/W
• Voltage - Forward (vf) Typ: 9.2V
• Wavelength: 625nm, 515nm, 460nm
• Lens Style/size: Round, 26.93mm
• Viewing Angle: 120°
• Mounting Type: Surface Mount
• Package / Case: 1.15" L x 1.15" W x 0.34" H (29.15mm x 29.15mm x 8.65mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 365-1396

Lednium Series Optimal X
OVTL09LG3x Series
Thermal Resistance
Optek Lednium Series 1-watt Cup – Measured value 2
Optek Lednium Series 10-watt Matrix – Measured value 2.5
Theory
resistance from the junction region ( j ) of the die, to the board (b) - PCB or other mounting surface. What this
means in a practical sense, is that when operating at rated input (1watt approx.) the junction of a die in a cup prod-
uct will attain a temperature that is 2
case of a 10-watt Matrix product, the maximum temperature difference between any junction and the reference
point is 25
elements in a series and or parallel configuration, but lumped together into a single parameter for convenience.
simple measurement of the temperature of the mounting surface. Optek recommends that the design value of sus-
tained die junction temperature be limited to 80
10-watt device must be constrained below 55
can theoretically operate at up to 78
serial conductive path through the package to the major radiating surface – which in this example is a single sided
PCB. Some additional radiation may occur directly from the upper surface of the package (not shown). This would
be conducted upward from the die surface through the transparent encapsulating material to the package surface
and be radiated from there. To all practical purposes this is a very minor effect. The polymer encapsulants in normal
use are poor conductors of heat.
OPTEK Technology Inc. — 1645 Wallace Drive, Carrollton, Texas 75006
Phone: [phone] or [phone] FAX: [phone] [e-mail] www.optekinc.com
In line with industry practice, the thermal resistance (Rth) of our LED packages is stated as Rθ
For an end user of LED products then, this constant allows the junction temperature to be determined by a
From the diagram above it can be seen that the heat generated in the junction region follows a somewhat
o
C (2.5
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
o
C/w x 10w). The thermal path thus quantified is a composite of a number of thermally resistive
o
o
C.
C higher than a reference point on the mounting surface beneath it. In the
o
C to comply with this recommendation, and for a 1-watt cup the board
o
C. In an ambient temperature of 25
o
C/w
o
C/w
o
C, the board temperature of a
(OVTL01LGAxx)
(OVTL09LG3xx)
j-b
, thermal
Issue B.2 07/08
Page 11 of 14