GM1BD78140A Sharp Microelectronics, GM1BD78140A Datasheet - Page 13

• Manufacturer Part Number: GM1BD78140A
• Description: LED 0.5WATT WHITE 2800K
• Manufacturer: Sharp Microelectronics

Specifications of GM1BD78140A

• Color: White, Warm
• Current - Test: 150mA
• Luminous Flux @ Current - Test: 29lm
• Current - Max: 200mA
• Lumens/watt @ Current - Test: 55lm/W
• Voltage - Forward (vf) Typ: 3.5V
• Wavelength: 2800K
• Lens Style/size: Rectangle, 2.64mm x 1.64mm
• Mounting Type: Surface Mount
• Package / Case: 0.1" L x 0.07" W x 0.03" H (2.64mm x 1.64mm x 0.7mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Viewing Angle: -
• Other names: 425-2716-1

● Cleaning Instructions
1. Sharp does not recommend cleaning printed circuit boards containing this device. Process chemicals will affect
2. Use solder paste that does not require cleaning.
● Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 17.
2. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
3. When using a second reflow, the second process should be carried out as soon as possible after the first, and
4. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
5. The Reflow Profile shown in Fig. 17 should be considered as a set of maximum parameters. Since this part uses
6. These parts may be used in a nitrogen reflow process, but may not be dip-soldered.
Fig. 17 Temperature Profile
7. When repairing boards containing this part, preheat it from room temperature at such a rate that it reaches
GM1BD78140A-20
the structural and optical characteristics of this device.
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
within three days.
damaged, thereby affecting solderability.
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended.
100°C after 90 s, ±30 s; then solder at a temperature between 250°C and 260°C; and within 10 seconds.
180 to 200
250 MAX.
220
25
1 to 4°C/s
90 to 120s
Time (second)
1 to 4°C/s
55 s MAX.
5 s MAX.
13
1 to 4°C/s
GM1BD78140A
Sheet No. DG-086015
July 30, 2008