HLMP-2755 Avago Technologies US Inc., HLMP-2755 Datasheet - Page 6

• Manufacturer Part Number: HLMP-2755
• Description: LED LT BAR 8.89X8.89MM SGL YLW
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-2755

• Color: Yellow
• Voltage Rating: 2.1V
• Current: 25mA
• Lens Type: Diffused
• Lens Style/size: Square, 8.89mm
• Configuration: Single
• Mounting Type: Through Hole
• Product: LED Light Bars
• Illumination Color: Yellow
• Luminous Intensity: 38 mcd
• Light Bar Length: 8.89 mm
• Supply Voltage: 2.1 V
• Supply Current: 20 mA
• Wavelength: 585 nm
• Current, Forward, Peak: 60 mA
• Light Emitting Area, Size: 8.89 x 8.89
• Power Dissipation: 85 mW
• Temperature, Operating: -40 to +85 °C
• Temperature, Soldering: 250 °C @ 3 Sec.
• Voltage, Breakdown, Reverse: 15 V (Typ.)
• Voltage, Forward: 2 V⁄ LED (Typ)
• Voltage, Reverse: 15 V ⁄LED (Typ)
• Wavelength, Dominant: 585 nm (Typ.)
• Wavelength, Peak: 583 nm (Typ.)
• Led Configuration: Bar
• Led Color: Yellow
• Forward Voltage: 2.1V
• Forward Current If: 20mA
• Display Size: 8.89mm X 8.89mm
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1254-5

Absolute Maximum Ratings
Notes:
1. Derate above 87 C at 1.7 mW/ C per LED chip. For DC operation, derate above 91 C at 0.8 mA/ C.
2. Derate above 25 C at 1.8 mW/ C per LED chip. For DC operation, derate above 50 C at 0.5 mA/ C.
3. Derate above 50 C at 1.8 mW/ C per LED chip. For DC operation, derate above 60 C at 0.5 mA/ C.
4. See Figure 1 to establish pulsed operation. Maximum pulse width is 1.5 mS.
5. See Figure 6 to establish pulsed operation. Maximum pulse width is 2 mS.
6. Does not apply to bicolor parts.
7. For operation below –20 C, contact your local Avago sales representative.
Electrical/Optical Characteristics at T
AlGaAs Red HLCP-X100 Series
6
Average Power Dissipated per LED Chip
Peak Forward Current per LED Chip
Average Forward Current per LED Chip
DC Forward Current per LED Chip
Reverse Voltage per LED Chip
Operating Temperature Range
Storage Temperature Range
Wave Soldering Temperature
1.6 mm (1/16 inch) below Body
Luminous Intensity
per Lighting Emitting
Area
Peak Wavelength
Dominant Wavelength
Forward Voltage per LED
Reverse Breakdown Voltage per LED
Thermal Resistance LED Junction-to-Pin
[1]
Parameter
Parameter
[2]
A100/D100/E100
B100/C100/F100/G100
H100
HLCP-
A
= 25 C
–20 C to +100 C
AlGaAs Red
HLCP-X100
37 mW
45 mA
15 mA
Series
15 mA
5 V
[4]
[1]
Symbol
[1]
R
PEAK
V
V
I
J-PIN
V
F
R
d
[7]
HLMP-2300/
2600/29XX
Min.
135 mW
12
90 mA
30 mA
3
6
5
Series
25 mA
250 C for 3 seconds
HER
–40 C to +85 C
–40 C to +85 C
[5]
[2]
Typ.
645
637
250
7.5
1.8
[2]
15
30
15
HLMP-2400/
Max.
2700/2950
2.2
85 mW
60 mA
25 mA
Yellow
Series
20 mA
6 V
[6]
Units
LED
mcd
mcd
mcd
C/W/
[5]
[3]
[3]
nm
nm
V
V
Test Conditions
–20 C to +85 C
HLMP-2500/
I
2800/2965
I
135 mW
R
I
F
90 mA
30 mA
F
Green
Series
= 100 A
25 mA
= 20 mA
= 3 mA
[5]
[2]
[2]