APA501-80-006 Emerson Network Power, APA501-80-006 Datasheet - Page 3
![HEATSINK (80) 115X59X37MM HORZ](/photos/28/30/283014/apa501-80-006_sml.jpg)
APA501-80-006
Manufacturer Part Number
APA501-80-006
Description
HEATSINK (80) 115X59X37MM HORZ
Manufacturer
Emerson Network Power
Type
Passiver
Specifications of APA501-80-006
Accessory Type
Heat Sink
Fin Style
Horizontal
Product Length (mm)
115mm
Product Height (mm)
37mm
Product Depth (mm)
59mm
Heatsink Material
Aluminum
For Use With/related Products
AMPSS®
Lead Free Status / RoHS Status
Supplier Unconfirmed
Lead Free Status / RoHS Status
Supplier Unconfirmed
Heatsinks
Heatsinks for AMPSS modules are available in a
variety of sizes and fin orientation. Mounting kits
and thermal pads are also available. The table
below shows the options available for "80" and "60"
module sizes.
A heatsink mounting kit provides the most conven-
ient way to mount the heatsink to the module and
then mount the assembly onto a circuit board
Description
Heatsink, "60" size, vertical fin.
Heatsink, "60" size, horizontal fin
Heatsink, "60" size, vertical fin.
Heatsink, "60" size, horizontal fin
Heatsink, "60" size, vertical fin.
Heatsink, "60" size, horizontal fin
Heatsink, "60" size, low profile
Heatsink, "80" size, vertical fin.
Heatsink, "80" size, horizontal fin
Heatsink, "80" size, vertical fin.
Heatsink, "80" size, horizontal fin
Heatsink, "80" size, vertical fin.
Heatsink, "80" size, horizontal fin
Heatsink, "80" size, low profile
Thermal Pad, "60" size
Thermal Pad, "80" size
Mounting Kit, Tapped Studs
Mounting Kit, Solder Studs
Mounting Kit, Tapped Studs
for low profile heatsink
Mounting Kit, Solder Studs
for low profile heatsink
Spring Sockets (20 cont. 15pwr)
Rev. 01 Jan 96
1
Model Number
APA501-60-001
APA501-60-002
APA501-60-003
APA501-60-004
APA501-60-005
APA501-60-006
APA501-60-007
APA501-80-001
APA501-80-002
APA501-80-003
APA501-80-004
APA501-80-005
APA501-80-006
APA501-80-007
APA502-60-001
APA502-80-001
APA503-00-001
APA503-00-002
APA503-00-007
APA503-00-008
APA504-00-001
AMPSS modules may be retained by their input and
output pins only, or may be fixed to the board using
bolts screwed into the tapped studs which are
provided as part of the mounting kit. In both cases
the studs provide clearance between the module and
the circuit board to facilitate PCB cleaning opera-
tions.
Note: baseplate and heatsink must be connected to
protective earth
2.26x2.32x0.6 57.5x59x15
2.26x2.32x0.6 57.5x59x15
2.26x2.32x0.9 57.5x59x22.5
2.26x2.32x0.9 57.5x59x22.5
2.26x2.32x1.5 57.5x59x37
2.26x2.32x1.5 57.5x59x37
2.25x3.50x0.5 57.2x89x12
4.53x2.32x0.6 115x59x15
4.53x2.32x0.6 115x59x15
4.53x2.32x0.9 115x59x22.5
4.53x2.32x0.9 115x59x22.5
4.53x2.32x1.5 115x59x37
4.53x2.32x1.5 115x59x37
4.55x3.50x0.5 115.6x89x12
2
inches
Dimensions
AMPSS
mm
®
Reference Manual
Free air thermal
resistance
3.8˚C/W
3.9˚C/W
3.3˚C/W
3.7˚C/W
2.8˚C/W
2.8˚C/W
3.6˚C/W
2.7˚C/W
2.4˚C/W
2.2˚C/W
2.0˚C/W
2.0˚C/W
1.7˚C/W
2.2˚C/W
3