MPD5D017S Murata Electronics North America, MPD5D017S Datasheet - Page 11

• Manufacturer Part Number: MPD5D017S
• Description: CONV DC/DC 5W 3.3VOUT 1.5A SMT
• Manufacturer: Murata Electronics North America
• Series: MPDr
• Type: Isolatedr

Specifications of MPD5D017S

• Output: 3.3V
• Number Of Outputs: 1
• Power (watts): 5W
• Mounting Type: Surface Mount
• Voltage - Input: 36 ~ 75V
• Package / Case: 7-DIP SMD Module
• 1st Output: 3.3 VDC @ 1.5A
• Size / Dimension: 1.06" L x 0.57" W x 0.17" H (26.8mm x 14.6mm x 4.4mm)
• Power (watts) - Rated: 5W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 84%
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Other names: 490-4580

1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’ s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
13 . Notice
Note:
13. 1 Soldering
13. 2 Cleaning
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
13. 1. 1 Flux
13. 1. 2 Solder
13. 1. 3 Recommended Soldering Conditions
13. 2. 1 Please clean this product to remove flux by using dip, boil, and vapor methods in isopropyl alcohol for
13. 2. 2 After cleaning, please dry this product thoroughly.
13. 2. 3 If you don’t clean this product with no-cleaning type flux, you must confirm fully in advance the reliability
Reflow Solder
Reflow Soldering Profiles
Please solder this product with Rosin Flux, which contains of 0.2wt%. or less chlorine.
Please do not use high activity acid flux or water soluble flux because they may erode metal or glass
portion of this product and may cause defectiveness or deterioration of this product.
Please use the solder H60, H63(JIS Z3282)or the equivalent type.
Please use the solder paste of equivalent type H60, H63.
※The solder used to this product is melted in reflow process.
If you touch the wet product, marking maybe erased or blurred.
Do not measure electrical characteristics, until this product gets dried enough.
of this product.
Profile details
Soldering temperature
Soldering time
Heating time
Preheating time
Programming rate
Descending rate
Total soldering time
Time
up to 5 minutes.
Please inform us if you are to use aqueous or semi –aqueous cleaning or other methods.
Do not use ultrasonic cleaning because semiconductor device on this product maybe damaged
by resonance.
JEDEC IPC/JEDEC J-STD-020D
Table 5-2 Classification Reflow Profiles
Pb-Free Assembly Large Body
Therefore do not add excessive vibration and strong air below to this product during reflow.
Please take out the products from a reflow furnace after the product temperature is cooled down
thoroughly.
When this product is mounted on backside of a motherboard like the below figure, the measurement
except soldering should be taken with dipping thermal setting resin around a Transformer Metal
Cover to prevent this product from dropping.
[Note] The product has a solder banking on the top of a lead pin.
Coplanarity is required with melting the solder banking during reflow process.
Therefore please confirm in advance that the solder banking is melted enough.
：30 seconds,240∼245
：245
：60∼150 seconds,217
：60∼120seconds,150∼200
：3
：6
：8 minutes Max.,25∼245
：
Maximum 2times
ºC
ºC
ºC
/sec.Max.,217∼245
/sec.Max.
+0/-5
ºC
ºC
Mother board
Isolated DC-DC Converter
ºC
or more.
ºC
ºC
MPD5D01*S Specification
2010.5.7
11