HW010A0F1 Lineage Power, HW010A0F1 Datasheet - Page 19

• Manufacturer Part Number: HW010A0F1
• Description: CONVERTER DC/DC 3.3V 33W OUT T/H
• Manufacturer: Lineage Power
• Series: HWr
• Type: Isolated with Remote On/Offr

Specifications of HW010A0F1

• Output: 3.3V
• Number Of Outputs: 1
• Power (watts): 33W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 18-DIP Module (6 Leads)
• 1st Output: 3.3 VDC @ 10A
• Size / Dimension: 1.86" L x 1.16" W x 0.34" H (47.2mm x 29.5mm x 8.6mm)
• Power (watts) - Rated: 33W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 90%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No RoHS Version Available

Data Sheet
June 26, 2009
Figure 51. Recommended Reflow profile.
Figure 52. Time Limit curve above 205
Lead Free Soldering
The -Z version SMT modules of the HW/HC series are lead-
free (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/
Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices) for both Pb-free solder profiles and
MSL classification procedures. This standard provides a rec-
ommended forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The sug-
gested Pb-free solder paste is Sn/Ag/Cu (SAC). The recom-
mended linear reflow profile using Sn/Ag/Cu solder is shown
in Figure. 53.
MSL Rating
The HW series SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling proce-
dures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
Lineage Power
300
200
250
100
150
240
235
230
225
220
205
200
215
210
50
0
0
10
Heat zone
max 4
Preheat zone
max 4
Peak Temp 235
20
REFLOW TIME (S)
o
Cs
o
Soak zone
30-240s
Cs
-1
TIME (S)
-1
30
o
C
40
T
205
lim
0
C.
o
above
C
50
Cooling
zone
1-4
HW006/010/012 Series Power Modules; dc-dc Converters
o
Cs
-1
36-75 Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
60
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of < 30°C and 60% relative humidity varies accord-
ing to the MSL rating (see J-STD-033A). The shelf life for dry
packed SMT packages will be a minimum of 12 months from
the bag seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Figure 53. Recommended linear reflow profile using Sn/
Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These require-
ments state that solder balls must neither be loose nor violate
the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
300
250
200
150
100
50
Per J-STD-020 Rev. C
0
Heating
Zone
Reflow Time (Seconds)
Peak Temp
* Min. Time
Above 235°C
*Time Above
217°C
Cooling
Zone
19