HW025FG Lineage Power, HW025FG Datasheet - Page 4

• Manufacturer Part Number: HW025FG
• Description: CONVR DC/DC 2.5/3.3V 25W OUT T/H
• Manufacturer: Lineage Power
• Series: HWr
• Type: Isolated with Remote On/Offr

Specifications of HW025FG

• Output: 3.3V, 2.5V
• Number Of Outputs: 2
• Power (watts): 25W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module
• 1st Output: 3.3 VDC @ 4A
• 2nd Output: 2.5 VDC @ 4A
• Size / Dimension: 2.26" L x 2.14" W x 0.29" H (57.4mm x 54.4mm x 7.4mm)
• Power (watts) - Rated: 25W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 83%
• Approvals: CE, CSA, UL, VDE
• Product: Isolated
• Output Power: 13 W
• Input Voltage Range: 36 V to 75 V
• Output Voltage (channel 1): 3.3 V
• Output Current (channel 1): 4 A
• Output Voltage (channel 2): 2.5 V
• Output Current (channel 2): 4 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 3.3 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No

36 Vdc to 75 Vdc Input, Dual Positive Outputs; 25W
HW025 Dual Positive Output-Series Power Modules: dc-dc Converters:
Electrical Specifications
Table 2. Output Specifications (continued)
Isolation Specifications
General Specifications
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be loose nor violate the power module minimum electrical spacing.
The cleanliness designator of the open frame power module is C00 (per J specification).
Solder, Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result
of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures,
refer to the Board-Mounted Power Modules Soldering and Cleaning Application Note
(AP97-021EPS).
4
Dynamic Response
Isolation Capacitance
Isolation Resistance
Calculated MTBF (I
Weight
( I
Load Change from IO1 = 50% to 75% of
Load Change from IO2 = 50% to 75% of
HW025AF
HW025FG
I
max; I
I
I
O
O1
O2
O1
Peak Deviation
Settling Time (V
Peak Deviation
Settling Time (V
/ t = 1 A/10 µs, V
deviation)
deviation)
, max or I
, max or I
= 30% of I
O2
= 30% of I
O2
O1
Parameter
O1
= 50% to 25% of I
= 50% to 25% of IO1,
, max:
O
O
O
= 80% of I
I
O2
< 10% of peak
< 10% of peak
= 48 V, T
, max:
Parameter
Parameter
O, max
ref
(continued)
= 25 °C):
O2
; T
, max;
A
= 20 °C)
Device
All
All
All
All
Symbol
Min
Min
10
—
—
—
—
—
—
4,000,000
4,900,000
Min
—
—
—
—
Typ
Typ
0.2
—
—
2000
2000
Typ
100
100
23 (0.81)
Max
Max
—
—
Max
—
—
—
—
Data Sheet
April 2008
Lineage Power
g (oz.)
hours
hours
Unit
Unit
M
nF
Unit
mV
mV
µs
µs