LDEEC3100KA5N00 Kemet, LDEEC3100KA5N00 Datasheet - Page 15

• Manufacturer Part Number: LDEEC3100KA5N00
• Description: CAP FILM .1UF 100V SMD
• Manufacturer: Kemet
• Series: LDE Arcotronicsr

Specifications of LDEEC3100KA5N00

• Capacitance: 0.1µF
• Voltage - Ac: 63V
• Voltage - Dc: 100V
• Dielectric Material: Polyethylene (PEN)
• Tolerance: ±10%
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 1812 (4532 Metric)
• Size / Dimension: 0.185" L x 0.130" W (4.70mm x 3.30mm)
• Height: 0.094" (2.40mm)
• Termination: Solder Pads
• Features: General Purpose
• Voltage Rating: 100 Volts
• Dissipation Factor Df: 0.8
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 3.2 mm W x 4.5 mm L x 2.4 mm H
• Product: PEN SMD Film Capacitors
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Esr (equivalent Series Resistance): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-5480-2

Soldering recommendations and cautions
Flux / Cleaning / Storage and Moisture
Flux suggestions
Storage and moisture recommendations
Manual assembly recommendations
Manual soldering recommendations
-
-
-
-
-
We suggest to use a no-clean flux with a halogen
content lower than 0.1%.
Arcotronics SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months
shelf life (temperature ≤ 40 °C / relative humidity ≤ 90%).
After the MBB has been opened, components may stay in areas with controlled temperature and humidity (temperature
≤ 30 °C / relative humidity ≤ 60%) for 168 hours (rated voltage ≤ 100 V
For longer periods of time and / or higher temperature and / or higher relative humidity values, it is absolutely necessary
to protect the components against humidity. If the reel inside the MBB is partially used, Arcotronics recommends to re-use
the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not
respected, components require a baking (minimum time: 48 hours at 55 ± 5 °C) before the reflow.
If PCBs are assembled manually, care must be taken to
avoid any mechanical damage to the components.
Our recommendations are the following (see Fig. 1):
1) when using tweezers, the components should be
2) avoid any contact with the two cutting surfaces (C);
3) a vacuum pen is recommended on the top and
LDE and LDB series have been designed for Surface Mount Technology, pick & place machines and reflow soldering
systems. Using a manual soldering iron, issues may occur because the typical temperature for manual soldering is
around 350 °C. Therefore please pay careful attention:
never touch the capacitor body with the sodering iron but rather touch the soldering iron and the end termination with the
tin wire edge (see Fig. 2);
if the soldering iron is equipped with a temperature controller device:
set the temperature to 250 ± 3 °C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 s);
if the soldering iron is NOT equipped with a temperature controller device:
this is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is
extremely important:
1) proceed as per Fig. 2;
2) as soon as the tin wire starts melting, move the soldering iron away as quickly as possible;
3) wait a few seconds and check that the soldering joint has been properly created;
if the soldering iron is equipped with a hot air flow device:
set the hot air temperature to 250 ± 3 °C and do not send the hot air directly onto the capacitor plastic body.
In this situation, the operator’s experience is very important;
in any case, avoid mass-mounting SMD Film Capacitors manually.
gripped across the two terminations (A);
bottom surfaces (B).
15
Cleaning suggestions
To clean the PCB assembly we suggest to use a suitable
solvent like Isopropyl Alcohol, deionized water or neutral
pH detergents. Solvents like Toluene, Xylene and
Trichloroethylene should not be used.
DC
) or 696 hours (rated voltage > 100 V
SMD Film Capacitors
Fig. 2
Fig. 1
DC
07/2008
).