LTM4616IV#PBF Linear Technology, LTM4616IV#PBF Datasheet - Page 20

• Manufacturer Part Number: LTM4616IV#PBF
• Description: IC DC/DC UMODULE DUAL 8A 144-LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM4616IV#PBF

• Design Resources: LTM4616 Spice Model
• Output: 0.6 ~ 5 V
• Number Of Outputs: 2
• Power (watts): 12W
• Mounting Type: Surface Mount
• Voltage - Input: 2.7 ~ 5.5 V
• Package / Case: 144-LGA
• 1st Output: 0.6 ~ 5 VDC @ 8A
• 2nd Output: 0.6 ~ 5 VDC @ 8A
• Size / Dimension: 0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
• Power (watts) - Rated: 12W
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -

LTM4616
Layout Checklist/Example
The high integration of LTM4616 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current paths,
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
applications inForMation
20
including V
V
and thermal stress.
tors next to the V
high frequency noise.
unit.
OUT2
. It helps to minimize the PCB conduction loss
IN1
, V
GND1
GND2
IN
IN2
V
V
IN1
IN2
, GND and V
, GND1 and GND2, V
C
C
IN1
IN2
M
OUT
K
H
G
D
C
B
A
L
J
F
E
1
pins to minimize
GND2
2
Figure 17. Recommended PCB Layout
3
V
IN1
OUT1
4
5
and
LTM4616 TOP VIEW
EACH CHANNEL
VIA TO GND
CONTROL1
CONTROL1 & 2
6
7
• To minimize the via conduction loss and reduce module
• Do not put vias directly on the pads, unless they are
• Use a separated SGND ground copper area for com-
• For parallel modules, tie the I
Figure 17 gives a good example of the recommended
layout.
CONTROL2
8
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
capped or plated over.
ponents connected to signal pins. Connect the SGND
to GND underneath the unit.
gether. Use an internal layer to closely connect these
pins together. All of the I
of the master regulator, then the master SGND connects
to GND.
9
10
11
V
OUT1
12
GND2
C
C
OUT2
OUT2
THM
4616 F17
pins connect to the SGND
V
GND1
V
GND2
TH
OUT1
OUT2
, FB and I
THM
pins to-
4616fc