AXH005A0XZ Lineage Power, AXH005A0XZ Datasheet - Page 16

• Manufacturer Part Number: AXH005A0XZ
• Description: CONVER DC/DC 0.75 3.63V @ 5A SIP
• Manufacturer: Lineage Power
• Series: Austin MicroLynx™r
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of AXH005A0XZ

• Output: 0.75 ~ 3.63V
• Number Of Outputs: 1
• Power (watts): 18W
• Mounting Type: Through Hole
• Voltage - Input: 3 ~ 5.5V
• Package / Case: 5-SIP Module
• 1st Output: 0.75 ~ 3.63 VDC @ 5A
• Size / Dimension: 0.90" L x 0.26" W x 0.40" H (22.9mm x 6.6mm x 10.2mm)
• Power (watts) - Rated: 18W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 94%
• Approvals: CSA, EN, UL, VDE
• Output Power: 18 W
• Input Voltage Range: 3 V to 5.5 V
• Output Voltage (channel 1): 0.75 V to 3.63 V
• Output Current (channel 1): 5 A
• Package / Case Size: SIP
• Output Type: Non-Isolated
• Output Voltage: 0.75 V to 3.63 V
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 555-1060; CC109104881

Data Sheet
July 2, 2010
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
LINEAGE
POWER
3 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 5A output current
Austin MicroLynx
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3 ° C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210 ° C. For Pb
solder, the recommended pot temperature is 260 ° C, while
the Pb-free solder pot is 270 ° C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power technical representative for more details.
TM
SIP Non-isolated Power Modules:
16