APTS030A0X3-SRPHZ Lineage Power, APTS030A0X3-SRPHZ Datasheet - Page 21

• Manufacturer Part Number: APTS030A0X3-SRPHZ
• Description: CONVERTER DC/DC 0.8 2.75V @ 30A
• Manufacturer: Lineage Power
• Series: Austin MegaTLynx™r
• Type: Point of Load (POL) Non-Isolatedr

Specifications of APTS030A0X3-SRPHZ

• Output: 0.8 ~ 2.75V
• Number Of Outputs: 1
• Power (watts): 82W
• Mounting Type: Surface Mount
• Voltage - Input: 6 ~ 14V
• Package / Case: Module
• 1st Output: 0.8 ~ 2.75 VDC @ 30A
• Size / Dimension: 1.30" L x 0.53" W x 0.39" H (33mm x 13.5mm x 10mm)
• Power (watts) - Rated: 82.5W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 91.8%
• Approvals: CSA, EN, UL, VDE
• Input Voltage Range: 6 V to 14 V
• Input Voltage (nominal): 12 V
• Output Voltage (channel 1): 1.5 V
• Output Current (channel 1): 30 A
• Package / Case Size: 33 mm x 13.46 mm x 10 mm
• Output Voltage: 0.8 V to 3.63 V
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 555-1140-2; CC109138351

Surface Mount Information
Pick and Place
The 12V Mega TLynx
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The
maximum nozzle outer diameter, which will safely fit
within the allowable component spacing, is 5 mm
max.
Tin Lead Soldering
The 12V Mega TLynx
free modules and can be soldered either in a lead-
free solder process or in a conventional Tin/Lead
(Sn/Pb) process. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board
assembly. The following instructions must be
observed when soldering these units. Failure to
observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.
LINEAGE
Data Sheet
November 11, 2010
Figure 37. Pick and Place Location.
POWER
TM
TM
SMT modules use an open
SMT power modules are lead
o
C. The label also carries
6.0 – 14Vdc Input; 0.8Vdc to 3.63Vdc Output; 30A output current
12V Mega TLynx
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 38. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 39. Time Limit Curve Above 205
for Tin Lead (Sn/Pb) process.
TM
o
300
200
250
240
235
230
225
220
205
200
: Non-Isolated DC-DC Power Modules:
215
210
100
C. Typically, the eutectic solder melts at 183
150
50
0
0
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
o
Co o ling
zo ne
1 -4
C Reflow
50
o
Cs
-1
o
21
60
C,