MPDTH03050WAH Murata Electronics North America, MPDTH03050WAH Datasheet - Page 10

• Manufacturer Part Number: MPDTH03050WAH
• Description: CONV DC/DC 15W .8-2.5VOUT 6A
• Manufacturer: Murata Electronics North America
• Series: MPDr
• Type: Point of Load (POL) Non-Isolatedr

Specifications of MPDTH03050WAH

• Output: 0.8 ~ 2.5V
• Number Of Outputs: 1
• Power (watts): 15W
• Mounting Type: Through Hole
• Voltage - Input: 2.95 ~ 3.65V
• Package / Case: 6-DIP Module
• 1st Output: 0.8 ~ 2.5 VDC @ 6A
• Size / Dimension: 0.87" L x 0.49" W x 0.33" H (22.1mm x 12.6mm x 8.5mm)
• Power (watts) - Rated: 15W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 94%
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Other names: 490-5067; MPDTH03050WAH

1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’ s specifications are subject to change or our
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product
Note:
15. 2 Cleaning
products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
specifications or transact the approval sheet for product specifications before ordering.
15 1. 2 PCB Land Pattern Recommendation
15. 1. 3 Soldering Conditions Recommendation
Please use no-clean type flux and do not wash this product.
Reflow Soldering Profile
Profile details
※ Elimination of any additional vibration applied to this device during reflow is
This product is RoHS compatible. The following profile is recommended for the reflow of the
SMD product (WAS) using Pb-free solder paste (Sn-Ag-Cu).
Method
highly recommended.
Careful regulation of temperature is recommended to avoid the separation of mounted components
from this device during reflow.
WAH
WAS
JEDEC IPC/JEDEC J-STD-020C
Table 5-2 Classification Reflow Profile
Pb-Free Assembly Large Body
Soldering temperature
Soldering time
Heating time
Preheating time
Programming rate
Descending rate
Total soldering time
Times
3.18
3.18
3.18
2.03
3.18
2.03
3.18
3.18
1
2
3
4
1
2
3
4
TOP VIEW
TOP VIEW
: 245
: 20 to 40 seconds, 240 to 245
: 60 to 150 seconds, over217
: 60 to 180 seconds,150 to 200
: 3
: 6
: 8 minutes Max., 25 to 245
: 1time
19.06
23.12
19.06
: Full convection reflow soldering
23.12
o
o
C/ sec. Max.,217 to 245
C/ sec. Max.
o
C+0/-5
6
5
6
5
o
C
2.03
2.03
φ2.16 Min. 6 Places
φ 1.40 Min. 6 Places
Plated through holes
o
o
C
C
o
C
o
o
C
C
MPDTH03050WA* Specification
2006.10.2
10