ATA006A0X4-SR Lineage Power, ATA006A0X4-SR Datasheet - Page 20

• Manufacturer Part Number: ATA006A0X4-SR
• Description: CONVERT DC/DC 0.75 5.5V @ 6A SMD
• Manufacturer: Lineage Power
• Series: Austin MicroLynx™ IIr
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of ATA006A0X4-SR

• Rohs Status: RoHS non-compliant
• Output: 0.75 ~ 5.5V
• Number Of Outputs: 1
• Power (watts): 33W
• Mounting Type: Surface Mount
• Voltage - Input: 8.3 ~ 14V
• Package / Case: 6-SMD Module
• 1st Output: 0.75 ~ 5.5 VDC @ 6A
• Size / Dimension: 1.10" L x 0.45" W x 0.29" H (27.9mm x 11.4mm x 7.2mm)
• Power (watts) - Rated: 33W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 89%
• Approvals: CSA, EN, UL, VDE
• 3rd Output: -
• 2nd Output: -
• Other names: 555-1021-2

Data Sheet
October 1, 2009
Surface Mount Information
Lead Free Soldering
The –Z version Austin MicroLynx II 12V SMT modules
are lead-free (Pb-free) and RoHS compliant and are
both forward and backward compatible in a Pb-free
and a SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 37.
MSL Rating
The Austin MicroLynx II 12V SMT modules have a
MSL rating of 3.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
LINEAGE
POWER
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
Austin MicroLynx
(continued)
TM
Figure 37. Recommended linear reflow profile
using Sn/Ag/Cu solder.
II 12V SMT Non-isolated Power Modules:
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
20
Cooling
Zone