XLT08DFN2 Microchip Technology, XLT08DFN2 Datasheet - Page 4
![SOCKET TRANSITION ICE 14DIP/8DFN](/photos/9/1/90111/xlt08dfn2_sml.jpg)
XLT08DFN2
Manufacturer Part Number
XLT08DFN2
Description
SOCKET TRANSITION ICE 14DIP/8DFN
Manufacturer
Microchip Technology
Datasheet
1.XLT06SOT.pdf
(42 pages)
Specifications of XLT08DFN2
Module/board Type
*
Product
Microcontroller Accessories
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
MPLAB™ICE
For Use With
AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC162070 - HEADER INTRFC MPLAB ICD2 8/14PDVA1004 - DEVICE ADAPTER 8/14/20DIPAC162058 - HEADER MPLAB ICD2 FOR PIC12F683DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
2010 Microchip Technology Inc.