XLT08SN-1 Microchip Technology, XLT08SN-1 Datasheet - Page 35
![SOCKET TRANSITION 8DIP/8SOIC](/photos/9/1/90112/xlt08sn-1_sml.jpg)
XLT08SN-1
Manufacturer Part Number
XLT08SN-1
Description
SOCKET TRANSITION 8DIP/8SOIC
Manufacturer
Microchip Technology
Datasheet
1.XLT06SOT.pdf
(42 pages)
Specifications of XLT08SN-1
Module/board Type
*
Product
Microcontroller Accessories
Lead Free Status / RoHS Status
Not applicable / Not applicable
For Use With/related Products
MPLAB™ICE
For Use With
AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC162070 - HEADER INTRFC MPLAB ICD2 8/14PAC162059 - HEADER INTRFC MPLAB ICD2 8/14PINDVA1004 - DEVICE ADAPTER 8/14/20DIPAC162058 - HEADER MPLAB ICD2 FOR PIC12F683AC162057 - MPLAB ICD 2 HEADER 14DIPDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets and
associated hardware are shown below.
FIGURE 5: QFP TRANSITION SOCKET
The QFP transition socket is required for use along with
the QFP device adapter. The device adapter is
equipped with four socket strips that interface with the
transition socket.
The following QFP transition sockets have been
discontinued:
• XLT44PT: One 44-lead QFP transition socket,
• XLT64PT1: One 64-lead QFP transition socket,
• XLT64PT2: One 64-lead QFP transition socket,
• XLT64PT3: One 64-lead QFP transition socket,
• XLT64PT4: One 64-lead QFP adapter socket and
• XLT80PT: One 80-lead QFP transition socket,
2010 Microchip Technology Inc.
Note:
0.80 mm
0.5 mm (PIC16C92X)
Note:
0.5 mm (PIC17CXXX)
0.8 mm (dsPIC30F)
one 64-lead QFP header (0.8 mm)
0.5 mm
Pin 1
TOP
VIEW
To avoid solder bridging, do not place vias
within 0.025-inch of the QFP footprint.
Also, any vias near the QFP should be
directly on the centerline of the pad.
The XLT64PT1 for the PIC16C92X is not
symmetrical. Please note Pin 1 orientation
prior to soldering to the target system.
1
ST92X
QFP Transition Socket
QFP Device Adapter
Cable to Processor Module
Target/Application Board
Transition Socket Specification
QFP TRANSITION SOCKET
SOLDERING TIPS
• Before soldering, consider keeping the
• Use controlled soldering iron tip temperatures
• If possible, use a PACE mini wave soldering iron
• Plan to solder one (1 of 4) side first, then the
• Soldering iron tip movement should be in the
• Use generous amounts of soldering flux to aid in
• If the break-away tabs are removed after solder-
XLT44PT (Discontinued – see XLT44PT3)
44-lead QFP to 0.8 mm Adapter Socket
The 64 and 80-pin QFP headers are very delicate
and can be easily damaged!
break-away tabs in place during soldering.
between 300C and 325C (570F to 615F)
tip or an equivalent tip design.
opposite side, then the remaining two sides.
direction of the leads (backward and forward), not
across the leads; dragging the tip across the
leads may cause lead damage.
the solder flow action.
ing (using a dental pick or equivalent), any solder
bridging between leads can be repaired by simply
gently touching the soldering tip to the lead tip.
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
FRONT/
SIDE
VIEW
TOP
VIEW
CAUTION
0.05
0.80 mm
0.365
0.90
0.80
0.55
0.65
DS51194S-page 35
0.90
0.300
0.130