XLT18SO-1 Microchip Technology, XLT18SO-1 Datasheet - Page 3

• Manufacturer Part Number: XLT18SO-1
• Description: SOCKET TRANSITION 18SOIC 300MIL
• Manufacturer: Microchip Technology

Specifications of XLT18SO-1

• Module/board Type: *
• Svhc: No SVHC (15-Dec-2010)
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14DVA1006 - DEVICE ADAPTER ICE2000 18DIPDVA1001 - ADAPTER FOR PIC16F716 18DIPDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000AC162054 - HEADER INTERFACE ICD2 16F716DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDAC162053 - HEADER INTERFACE ICD,ICD2 18DIPDVA16XP185 - ADAPTER DEVICE ICE 18DIP/SOICDVA16XP183 - ADAPTER ICE 18DIP/SOIC/SSOPDVA16XP182 - ADAPTR 712,716 DIP,SOIC,SSOPDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

INTRODUCTION
Transition sockets are devices that allow MPLAB
2000 and MPLAB ICE 4000 device adapters, or
MPLAB ICD 2 and MPLAB REAL ICE™ in-circuit emu-
lator header boards, to interface to sockets on cus-
tomer products that differ from the standard adapter
connection.
Embedded microcontrollers/microprocessors come in
many different types of IC packages, (i.e., DIP, PLCC,
SOIC, SSOP, MQFP, etc.). Typically, development
cycle components are EPROM-based and, as a result,
are provided in larger windowed package formats such
as DIP or PLCC. Production components are primarily
preprogrammed ROM, OTP or Flash-based, and are
often in very compact SOIC, SSOP, MQFP or PQFP
package formats.
The solution is transition sockets. A transition socket is
specifically designed to provide compatibility between
two differing types of IC package formats.
Transition sockets are typically composed of two parts:
the DIP adapter socket and the SOIC/SSOP header.
The DIP adapter socket is designed to plug into the DIP
device adapter or header board on one side, and the
header on the other. The header is then soldered down
to the target application.
The QFP Adapter is a single part soldered directly to
the target application and fits into the QFP device
adapter or header board.
WHY SHOULD I USE TRANSITION
SOCKETS IN MY PRODUCT DESIGN?
There are two very significant advantages to using
transition sockets:
1.
2.
A typical product design cycle has two important
phases: the prototype design phase and the production
design phase. Traditionally, these phases were differ-
ent simply because the prototype used a microcontrol-
ler with a different package type. However, with the
availability of the transition sockets, the prototype
design can be identical to the production design
because a transition socket can be used to bridge the
microcontroller package differences.
© 2006 Microchip Technology Inc.
Shorter product development cycle.
Reduced expense in the design, layout and
prototype testing.
Transition Socket Specification
®
ICE
WHAT TRANSITION SOCKETS ARE
CURRENTLY AVAILABLE?
Microchip Technology currently offers the transition
sockets listed in the Table of Contents following this
introductory section.
The “Product Selector Guide” (DS00148) lists the tran-
sition sockets available for each device adapter of the
MPLAB ICE 2000 or 4000 system and for each header
board of the MPLAB ICD 2 or MPLAB REAL ICE in-cir-
cuit emulator system. For more on device adapters and
header boards, see:
• “MPLAB
• “MPLAB
• “Header Board Specification” (DS51292)
Please
(www.microchip.com) for the most current version of all
documents.
HOW CAN I OBTAIN MAXIMUM
BENEFIT FROM THE USE OF
TRANSITION SOCKETS?
Attention
considered to provide adequate clearance for the
transition socket interface to the PCB footprint. This is
especially true for any tall components such as connec-
tor headers, radial components or voltage regulators.
Refer to the transition socket mechanical drawings for
dimensions.
Device Adapter Specification” (DS51140)
Device Adapter Specification” (DS51298)
®
®
check
to
ICE 2000 Processor Module and
ICE 4000 Processor Module and
component
the
Microchip
placement
DS51194P-page 1
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