EVB-USB2240-IND SMSC, EVB-USB2240-IND Datasheet - Page 5

• Manufacturer Part Number: EVB-USB2240-IND
• Description: EVALUATION BOARD USB2241-AEZG
• Manufacturer: SMSC

Specifications of EVB-USB2240-IND

• Main Purpose: Memory, SD/MMC
• Embedded: No
• Utilized Ic / Part: USB2241
• Primary Attributes: Read and Write to Over 22 Flash Media Formats from xD, MS, SD, and MMC
• Secondary Attributes: Socket for External EEPROM Expansion, USB Power with 3.3 V Regulator
• Interface Type: USB
• Product: Interface Modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: USB2240
• Other names: 638-1078

EVB-USB2240-IND User Manual Revision B
SMSC EVB-USB2240-IND
2.1.8
Layout Considerations
The EVB-USB2240-IND is designed on four PCB layers: two signal layers and two supply layers. The
PCB layer stack is shown in
layers are ground and power. Note that the media I/F signals flow easily to their destination connectors
simplifying routing of critical signals.
The component side top layer is shown in
locations. Solder side and bottom layer is shown in
Component Side
Solder mask
Solder mask
Solder Side
Pre-preg
Pre-preg
Layer 1
Layer 2
Layer 3
Layer 4
Core
Figure 2.1 USBDM Configuration Interface
Table
Table 2.3 PCB layer stack
USER MANUAL
2.3. All signals are routed on top and bottom layers. The internal
Figure 2.2
5
4.25 mil, +/- 0.25 mil FR-4
4.25 mil, +/- 0.25 mil FR-4
1.8 - 3.1 mil, finished
1.8 - 3.1 mil, finished
1.3 mil (nominal)
1.3 mil (nominal)
~28 mil FR-4
Figure
with silk screen information to identify component
2.3.
Revision 1.0 (07-17-09)