DM164130-3 Microchip Technology, DM164130-3 Datasheet - Page 11

• Manufacturer Part Number: DM164130-3
• Description: BOARD DEMO FOR PIC16F/PIC18F
• Manufacturer: Microchip Technology

Specifications of DM164130-3

• Main Purpose: Interface, LIN + MCU
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: PIC16F, PIC18F
• Primary Attributes: Automotive Grade Transceiver
• Secondary Attributes: LED Status Indicators
• Processor To Be Evaluated: PIC16F, PIC18F
• Processor Series: PICxxFIxxx
• Tool Type: Demonstration Board
• Core Architecture: PIC
• Cpu Core: PIC
• Data Bus Width: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

“Quality Comes First” is at the top of the list of Guiding
Values for Microchip Technology. As an ISO/TS-16949
certified supplier since 2003, Microchip’s Aggregate
System uniquely supports our commitment to
exceptional quality. In an environment where enterprise
wide commitment to continuous improvement is
demonstrated and every employee is responsible for
quality.
Quality and Reliability
With nearly 20 years of experience in serving the demanding requirements of the automotive customer, Microchip
Technology has a proven track record of success in delivering the total product solution to our valued customers that
is cost effective and reliable.
Corporate Headquarters
C
Chandler, Arizona
Commitment to the Relentless Quest for Perfection
DATE:
SUBJECT:
REVISION:
FA #:
MICROCHIP P/N:
Trace Code:
MASK NO.:
CUSTOMER:
Customer Part #:
Customer Tracking Number:
1. USE TEAM APPROACH:
Andy Birrell
Roger Melcher
Anupam Menghal
Craig Comeaux
Steve Vernier
2. DESCRIBE PROBLEM:
One 24LC16B device was returned when the customer reported that device is
failed in end user applications. The device failure has been confirmed during
bench testing as well as ATE testing. All the pins appeared normal during initial
curve tracing. Bench testing revealed that the device was drawing abnormally
high current. It is also confirmed that the multiple addresses in array are flipping
with each read. The ATE testing also revealed that the returned unit may have
failed the parametric or functional tests.
t H d
AUTOMOTIVE PRODUCTS GROUP
- Yield Enhancement Engineering Manager
- Wafer Manufacturing Engineer
- APG Quality Engineer
- Failure Analysis Engineer
- APG Product Engineer
8-D REPORT
August 28, 2007
defect VIA
A
C070816
24LC16B
06443WV
C5AR3
TRW
59141550
204115
t
Fab 2
Tempe, Arizona
Part Name
Shown on Drawing Number
Engineering Change Level
Additional Engineering Changes
Safety and/or Government Regulation
Checking Aid Number
ORGANIZATION MANUFACTURING INFORMATION
Microchip Technology Inc.
Organization Name & Supplier/Vendor Code
2355 W Chandler Blvd.
Street Address
Chandler
City
MATERIALS REPORTING
Has customer-required Substances of Concern information been reported?
Are polymeric parts identified with appropriate ISO marking codes?
REASON FOR SUBMISSION (Check at least one)
REQUESTED SUBMISSION LEVEL (Check one)
SUBMISSION RESULTS
The results for
These results meet all design record requirements:
Mold / Cavity / Production Process
DECLARATION
I affirm that the samples represented by this warrant are representative of our parts, which were made by a process that meets all Production
Part Approval Process Manual 4th Edition Requirements. I further affirm that these samples were produced at the production rate of
_N/A___/_N/A___ hours. I also certify that documented evidence of such compliance is on file and available for your review. I have noted any
deviation from this declaration below.
EXPLANATION/COMMENTS:
Is each Customer Tool properly tagged and numbered?
Organization Authorized Signature
Print Name
Title
PPAP Warrant Disposition:
Customer Signature
Print Name
Initial submission
Engineering Change(s)
Tooling: Transfer, Replacement, Refurbishment, or additional
Correction of Discrepancy
Tooling Inactive > than 1 year
Level 1 - Warrant only (and for designated appearance items, an Appearance Approval Report) submitted to customer.
Level 2 - Warrant with product samples and limited supporting data submitted to customer.
Level 3 - Warrant with product samples and complete supporting data submitted to customer.
Level 4 - Warrant and other requirements as defined by customer.
Level 5 - Warrant with product samples and complete supporting data reviewed at organization's manufacturing location.
Corporate Quality
Submitted by IMDS or other customer format:
dimensional measurements
Arizona
Region
Pb-Free
PPAP#
Approved
FOR CUSTOMER USE ONLY (IF APPLICABLE)
Postal Code
85224
N/A
Checking Aid Eng. Change Level
Yes
E-mail
material and functional tests
Phone No.
Rejected
Country
N/A
USA
Yes
No
CUSTOMER SUBMITTAL INFORMATION
Customer Tracking Number (optional)
Part Submission Warrant
Yes
NO
Cust. Part Number
Orig. Part Number
Purchase Order No.
Customer Name/Division
Buyer/Buyer Code
Application
Node ID#
Other
No
(If "NO" - Explanation Required)
appearance criteria
Change to Optional Construction or Material
Sub-Supplier or Material Source Change
Change in Part Processing
Parts produced at Additional Location
Other - please specify
n/a
Yes
Yes
Dated
Dated
N/A
Fax No.
N/A
No
No
Date
Date
N/A
statistical process package
480-792-4317
Dated
Weight (kg)
n/a
n/a
N/A
N/A
N/A
duction
ted any
age
rate of
Fab 4
Gresham, Oregon
STRESS TEST QUALIFICATION
Automotive Electronics Council
FAILURE MECHANISM BASED
Microchip supports various automotive quality
initiatives:






 Zero Defect Initiatives
 APQP – Advanced Product/Process Quality Planning
 AEC-Q100 Stress Testing
 PPAP – Production Part Approval Process
 8D Reporting
 Product Change Notification
INTEGRATED CIRCUITS
Component Technical Committee
FOR
AEC - Q100 - Rev-G
www.microchip.com/quality
May 14, 2007
Product Assembly/Test
Bangkok, Thailand
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