MCP7382XEV Microchip Technology, MCP7382XEV Datasheet - Page 3

• Manufacturer Part Number: MCP7382XEV
• Description: KIT EVALUATION FOR MCP7382X
• Manufacturer: Microchip Technology
• Type: Battery Managementr

Specifications of MCP7382XEV

• Main Purpose: Power Management, Battery Charger
• Embedded: No
• Utilized Ic / Part: MCP73826, MCP73827, MCP73828
• Primary Attributes: 1 Cell- Li-Ion / Li-Pol, 4.2V @ 1A, 4.5 ~ 6 Vin
• Product: Power Management Modules
• For Use With/related Products: MCP73826, MCP73827, MCP73828
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MCP7382XEVR; MCP7382XEVR

Preface ........................................................................................................................... 1
Chapter 1. Product Overview ....................................................................................... 5
Chapter 2. Installation and Operation ......................................................................... 7
Appendix A. Schematic and Board Layouts.............................................................. 11
Appendix B. Bill Of Materials (BOM) .......................................................................... 17
Worldwide Sales and Service .................................................................................... 18
© 2006 Microchip Technology Inc.
1.1 Introduction ..................................................................................................... 5
1.2 What the MCP7382X Evaluation Kit Is ........................................................... 5
1.3 MCP7382X Evaluation Kit Components ......................................................... 5
2.1 Description ..................................................................................................... 7
2.2 Features ......................................................................................................... 7
2.3 Getting Started ............................................................................................... 8
2.4 Detailed Description ....................................................................................... 9
A.1 Introduction .................................................................................................. 11
A.2 Highlights ..................................................................................................... 11
A.3 Board Schematic ........................................................................................ 12
A.4 Board Layout - Top Assembly .................................................................... 13
A.5 Board Layout - Top Layer .......................................................................... 14
A.6 Board Layout - Bottom Layer ..................................................................... 15
Table of Contents
MCP7382X EVALUATION KIT
USER’S GUIDE
DS51267B-page iii