SD007EVK National Semiconductor, SD007EVK Datasheet - Page 7
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SD007EVK
Manufacturer Part Number
SD007EVK
Description
BOARD EVALUATION CLC007
Manufacturer
National Semiconductor
Datasheet
1.CLC007BMNOPB.pdf
(10 pages)
Specifications of SD007EVK
Design Resources
SD007EVK Schematic
Main Purpose
Interface, Digital Cable Driver
Utilized Ic / Part
CLC007
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Secondary Attributes
-
Embedded
-
Primary Attributes
-
OUTPUT RISE AND FALL TIMES
Output load capacitance can significantly affect output rise
and fall times. The effect of load capacitance, stray or other-
wise, may be reduced by placing the output back-match
PCB Layout Recommendations
Printed circuit board layout affects the performance of the
CLC007. The following guidelines will aid in achieving satis-
factory device performance.
•
•
•
Use a ground plane or power/ground plane sandwich
design for optimum performance.
Bypass device power with a 0.01 µF monolithic ceramic
capacitor in parallel with a 6.8 µF tantalum electrolytic
capacitor located no more than 0.1” (2.5 mm) from the
device power pins.
Provide short, symmetrical ground return paths for:
FIGURE 7. Differential Input DC Coupled Output
FIGURE 8. Rise Time vs C
7
resistor close to the output pin and by minimizing all intercon-
necting trace lengths. Figure 8 shows the effect on risetime
of parallel load capacitance across a 150Ω load.
•
— inputs,
— supply bypass capacitors and
— the output load.
Provide short, grounded guard traces located
— under the centerline of the package,
— 0.1” (2.5 mm) from the package pins
— on both top and bottom of the board with connecting
vias.
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10008510
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