MAX13047EEVKIT+ Maxim Integrated Products, MAX13047EEVKIT+ Datasheet - Page 2

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MAX13047EEVKIT+

Manufacturer Part Number
MAX13047EEVKIT+
Description
KIT EVALUATION FOR MAX13047
Manufacturer
Maxim Integrated Products
Datasheets

Specifications of MAX13047EEVKIT+

Main Purpose
Interface, Logic-Level Translator
Embedded
No
Utilized Ic / Part
MAX13047E
Primary Attributes
2 Channel Bi-Directional
Secondary Attributes
Translates Between VL & VCC Logic Levels for Data Rates up to 16Mbps
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Single- and Dual-Bidirectional
Low-Level Translator
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
V
I/O V
I/O V
SHDN........................................................................-0.3V to +6V
Short-Circuit Duration I/O V
Power Dissipation (T
ELECTRICAL CHARACTERISTICS
(V
+85°C, unless otherwise noted. Typical values are V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
POWER SUPPLY
V
V
Supply Current from V
Supply Current from V
V
V
I/O V
Leakage Current
SHDN Input Leakage
ESD PROTECTION
I/O V
All Other Pins
LOGIC-LEVEL THRESHOLDS
I/O V
I/O V
CC
L
CC
..............................................................................-0.3V to +4V
6-Pin µDFN (derate 2.1mW/°C above +70°C) .............168mW
10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW
L
CC
CC
L
Supply Range
Shutdown-Mode Supply Current
_______________________________________________________________________________________
...........................................................................-0.3V to +6V
CC
L
= +1.65V to +5.5V, V
Supply Range
Shutdown-Mode Supply Current
L
CC
L
L
............................................................-0.3V to (V
and I/O V
Input-Voltage High
Input-Voltage Low
.......................................................-0.3V to (V
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
(Note 4)
PARAMETER
CC
A
Shutdown-Mode
= +70°C)
CC
L
L
L
, I/O V
= +1.1V to minimum of either +3.6V or ((V
CC
to GND...........Continuous
SYMBOL
I
I
SD-VCC
SD-LKG
I
I
QVCC
SD-VL
V
I
V
V
QVL
V
IHL
CC
ILL
L
CC
CC
= +3.3V, V
L
V
V
T
T
T
T
Human Body Model
IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
Human Body Model
+ 0.3V)
+ 0.3V)
A
A
A
A
CC
CC
= +25°C, SHDN = GND
= +25°C, SHDN = GND
= +25°C, SHDN = GND
= +25°C
> 3.3V
≤ 3.3V
L
= +1.8V at T
CONDITIONS
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
CC
6-Pin µDFN .................................................................477°C/W
10-Pin UTQFN ...........................................................20.1°C/W
6-Pin µDFN ................................................................20.1°C/W
10-Pin UTQFN .........................................................143.1°C/W
+ 0.3V)), I/O V
A
= +25°C.) (Notes 2, 3)
L
and I/O V
CC
1.65
MIN
V
1.1
1.1
0.2
L
are unconnected, T
-
±15V
±15V
TYP
0.03
0.03
0.02
0.02
±8V
±2
V
JA
JC
CC
) (Note 1)
) (Note 1)
+ 0.3V
MAX
3.6V
0.15
5.5
0.5
0.1
10
15
1
1
A
= -40°C to
UNITS
µA
µA
µA
µA
µA
µA
kV
kV
V
V
V
V

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