LM4866LQBD National Semiconductor, LM4866LQBD Datasheet
LM4866LQBD
Specifications of LM4866LQBD
Related parts for LM4866LQBD
LM4866LQBD Summary of contents
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... Typical Application Note: Pin out shown for LLP package. Refer to the Connection Diagrams for the pinout of the TSSOP package. Boomer ® registered trademark of National Semiconductor Corporation. © 2005 National Semiconductor Corporation Key Specifications THD+N O LM4866LQ, 3Ω ...
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Connection Diagrams See NS Package Number LQA24A for Exposed-DAP LLP See NS Package Number MXA20A for Exposed-DAP TSSOP www.national.com 20018629 Top View Order Number LM4866MT See NS Package Number MTC20 for TSSOP 20018630 Top View Order Number LM4866LQ 20018643 Top ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 4) ESD Susceptibility(Note 5) ESD Susceptibility (Note 6) Junction Temperature Solder Information Small Outline Package Vapor Phase (60 sec ...
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Electrical Characteristics for Bridged-Mode Operation The following specifications apply for V Symbol Parameter THD+N Total Harmonic Distortion+Noise PSRR Power Supply Rejection Ratio X Channel Separation TALK SNR Signal To Noise Ratio Note 3: Absolute Maximum Ratings indicate limits beyond which ...
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Typical Performance Characteristics LQ Specific Characteristics LM4866LQ THD+N vs Output Power LM4866LQ THD+N vs Output Power LM4866LQ Power Dissipation vs Power Output Note 17: This curve shows the LM4866LQ’s thermal dissipation ability at different ambient temperatures given this condition: 2 ...
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Typical Performance Characteristics MTE Specific Characteristics LM4866MTE THD+N vs Output Power LM4866MTE THD+N vs Output Power LM4866MTE Power Dissipation vs Power Output Note 18: This curve shows the LM4866MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM ...
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Typical Performance Characteristics THD+N vs Frequency THD+N vs Output Power THD+N vs Output Power 20018603 20018661 20018660 7 THD+N vs Output Power 20018606 THD+N vs Frequency 20018663 THD+N vs Frequency 20018662 www.national.com ...
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Typical Performance Characteristics Output Power vs Supply Voltage Power Dissipation vs Output Power Power Derating Curve www.national.com (Continued) 20018609 20018614 20018616 8 Output Power vs Load Resistance 20018612 Dropout Voltage vs Supply Voltage 20018615 Noise Floor 20018618 ...
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Typical Performance Characteristics Channel Separation Open Loop Frequency Response External Components Description (Refer to Figure 1.) Components 1. R The Inverting input resistance, along with R i filter with f = 1/(2π The input coupling capacitor blocks ...
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... Demonstration Board Layout section. Further detailed and specific information concerning PCB layout, fabrication, and mounting an LLP package is avail- able from National Semiconductor’s AN-1187. PCB LAYOUT AND SUPPLY REGULATION CONSIDER- ATIONS FOR DRIVING 3Ω AND 4Ω LOADS Power dissipated by a load is a function of the voltage swing across the load and the load’ ...
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Application Information * Refer to the section Proper Selection of External Components, for a detailed discussion of C FIGURE 1. Typical Audio Amplifier Application Circuit Pin out shown for the LLP package. Refer to the Connection Diagrams for the pinout ...
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Application Information fier. From Equation (3), assuming a 5V power supply and an 4Ω load, the maximum single channel power dissipation is 1.27W or 2.54W for stereo operation (2π R DMAX ...
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Application Information SELECTING PROPER EXTERNAL COMPONENTS Optimizing the LM4866’s performance requires properly se- lecting external components. Though the LM4866 operates well when using external components with wide tolerances, best performance is achieved by optimizing component val- ues. The LM4866 is ...
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Application Information AUDIO POWER AMPLIFIER DESIGN Audio Amplifier Design: Driving 1W into an 8Ω Load The following are the desired operational parameters: Power Output: Load Impedance: Input Level: Input Impedance: Bandwidth: 100Hz−20 kHz The design begins by specifying the minimum ...
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Application Information FIGURE 2. Recommended LQ PC board layout: Component-side Silkscreen FIGURE 3. Recommended LQ PC board layout: Component-side layout (Continued) FIGURE 4. Recommended LQ PC board layout: 20018631 FIGURE 5. Recommended LQ PC board layout: 20018632 15 20018633 upper ...
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Application Information FIGURE 6. Recommended LQ PC board layout: bottom-side layout FIGURE 7. Recommended MTE board layout: component-side silkscreen www.national.com (Continued) FIGURE 8. Recommended MTE PC board layout: 20018635 FIGURE 9. Recommended MTE board layout: 20018644 16 20018645 component-side layout ...
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Application Information FIGURE 10. Recommended MTE PC board layout: lower inner-layer layout FIGURE 11. Recommended MTE board layout: bottom-side layout (Continued) 20018647 FIGURE 12. Recommended MT PC board layout: 20018648 FIGURE 13. Recommended MT board layout: 17 20018649 component-side silkscreen ...
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Application Information www.national.com (Continued) FIGURE 14. Recommended MT PC board layout: bottom-side layout 18 20018650 ...
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Revision History Rev 1.1 Date 04/28/05 Changed (min) to (max) for I 19 Description units SD www.national.com ...
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Physical Dimensions 20-Lead Molded PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH 20-Lead Molded TSSOP, Exposed Pad, 6.5x4.4x0.9mm www.national.com inches (millimeters) unless otherwise noted Order Number LM4866MT NS Package Number MTC20 Order Number LM4866MTE NS Package Number MXA20A 20 ...
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