IRDC3629A International Rectifier, IRDC3629A Datasheet - Page 14

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IRDC3629A

Manufacturer Part Number
IRDC3629A
Description
BOARD EVAL SYNC BUCK CONTROLLER
Manufacturer
International Rectifier
Datasheets
IRDC3629A
Solder Resist
 The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-
alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask Defined
(NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
 The minimum solder resist width is 0.13mm.
At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a
solder resist width of ≥ 0.17mm remains.
 The land pad should be Non Solder Mask Defined (NSMD), with a minimum pullback of the solder resist off the
copper of 0.06mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of
the solder resist strip separating the lead lands from the pad land.
Each via in the land pad should be tented or plugged from bottom boardside with solder resist.
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