LM3481EVAL National Semiconductor, LM3481EVAL Datasheet - Page 16
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LM3481EVAL
Manufacturer Part Number
LM3481EVAL
Description
BOARD EVAL FOR LM3481
Manufacturer
National Semiconductor
Specifications of LM3481EVAL
Main Purpose
DC/DC, Step Up
Outputs And Type
1, Non-Isolated
Voltage - Output
12V
Current - Output
1.5A
Voltage - Input
3 ~ 11V
Regulator Topology
Boost
Frequency - Switching
300kHz
Board Type
Fully Populated
Utilized Ic / Part
LM3481
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Power - Output
-
www.national.com
4.
5.
The off-state voltage of the MOSFET is approximately equal
to the output voltage. V
greater than the output voltage. The power losses in the
MOSFET can be categorized into conduction losses and ac
switching or transition losses. R
the conduction losses. The conduction loss, P
I
is given by:
where D
At high switching frequencies the switching losses may be the
largest portion of the total losses.
The switching losses are very difficult to calculate due to
changing parasitics of a given MOSFET in operation. Often,
the individual MOSFET datasheet does not give enough in-
formation to yield a useful result. The following formulas give
a rough idea how the switching losses are calculated:
INPUT CAPACITOR SELECTION
Due to the presence of an inductor at the input of a boost
converter, the input current waveform is continuous and tri-
angular, as shown in
input capacitor sees fairly low ripple currents. However, as the
input capacitor gets smaller, the input ripple goes up. The rms
current in the input capacitor is given by:
The input capacitor should be capable of handling the rms
current. Although the input capacitor is not as critical in a
boost application, low values can cause impedance interac-
tions. Therefore a good quality capacitor should be chosen in
the range of 100 µF to 200 µF. If a value lower than 100 µF is
used, then problems with impedance interactions or switching
noise can affect the LM3481. To improve performance, es-
pecially with V
resistor at the input to provide a RC filter. This resistor is
placed in series with the V
attached to the V
µF ceramic capacitor is necessary in this configuration. The
bulk input capacitor and inductor will connect on the other side
of the resistor with the input power supply.
2
R loss across the MOSFET. The maximum conduction loss
Reverse transfer capacitance, C
Maximum drain to source voltage, V
MAX
is the maximum duty cycle.
IN
below 8V, it is recommended to use a 20Ω
IN
pin directly (see
Figure
DS(MAX)
IN
13. The inductor ensures that the
pin with only a bypass capacitor
DS(ON)
of the MOSFET must be
Figure
RSS
is needed to estimate
DS(MAX)
15). A 0.1 µF or 1
COND
, is the
16
OUTPUT CAPACITOR SELECTION
The output capacitor in a boost converter provides all the out-
put current when the inductor is charging. As a result it sees
very large ripple currents. The output capacitor should be ca-
pable of handling the maximum rms current. The rms current
in the output capacitor is:
Where
and D, the duty cycle is equal to (V
The ESR and ESL of the output capacitor directly control the
output ripple. Use capacitors with low ESR and ESL at the
output for high efficiency and low ripple voltage. Surface
mount tantalums, surface mount polymer electrolytic and
polymer tantalum, Sanyo- OSCON, or multi-layer ceramic ca-
pacitors are recommended at the output.
DRIVER SUPPLY CAPACITOR SELECTION
A good quality ceramic bypass capacitor must be connected
from the V
capacitor supplies the transient current required by the inter-
nal MOSFET driver, as well as filtering the internal supply
voltage for the controller. A value of between 0.47µF and
4.7µF is recommended.
LAYOUT GUIDELINES
Good board layout is critical for switching controllers such as
the LM3481. First the ground plane area must be sufficient for
thermal dissipation purposes and second, appropriate guide-
lines must be followed to reduce the effects of switching noise.
Switch mode converters are very fast switching devices. In
such devices, the rapid increase of input current combined
with the parasitic trace inductance generates unwanted Ldi/
dt noise spikes. The magnitude of this noise tends to increase
as the output current increases. This parasitic spike noise
may turn into electromagnetic interference (EMI), and can al-
so cause problems in device performance. Therefore, care
must be taken in layout to minimize the effect of this switching
noise. The current sensing circuit in current mode devices can
be easily effected by switching noise. This noise can cause
duty cycle jitter which leads to increased spectral noise. Al-
though the LM3481 has 250 ns blanking time at the beginning
of every cycle to ignore this noise, some noise may remain
after the blanking time.
The most important layout rule is to keep the AC current loops
as small as possible.
boost converter. The top schematic shows a dotted line which
represents the current flow during on-state and the middle
FIGURE 15. Reducing IC Input Noise
CC
pin to the PGND pin for proper operation. This
Figure 16
shows the current flow of a
OUT
− V
IN
20136593
)/V
OUT
.