NCP3065D1SLDGEVB ON Semiconductor, NCP3065D1SLDGEVB Datasheet - Page 18
![EVAL BOARD FOR NCP3065D1SLDG](/photos/28/39/283964/ncp3065d1sldgevb_sml.jpg)
NCP3065D1SLDGEVB
Manufacturer Part Number
NCP3065D1SLDGEVB
Description
EVAL BOARD FOR NCP3065D1SLDG
Manufacturer
ON Semiconductor
Specifications of NCP3065D1SLDGEVB
Design Resources
NCP3065D1SLDGEVB BOM NCP3065D1SLDGEVB Gerber Files NCP3065D1SLDGEVB Schematic
Current - Output / Channel
350mA
Outputs And Type
1, Non-Isolated
Voltage - Output
14.4V
Voltage - Input
12V
Utilized Ic / Part
NCP3065
Core Chip
NCP3065
Topology
SEPIC
No. Of Outputs
1
Development Tool Type
Hardware - Eval/Demo Board
Leaded Process Compatible
Yes
Mcu Supported Families
NCP3065
Peak Reflow Compatible (260 C)
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
NCP3065D1SLDG
Other names
NCP3065D1SLDGEVBOS
PUBLICATION ORDERING INFORMATION
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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2X
8X
2X
REFERENCE
NOTE 4
PIN ONE
0.15
0.10
0.08
DETAIL A
0.15
K
C
C
C
e
É É É
É É É
C
BOTTOM VIEW
SIDE VIEW
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç
TOP VIEW
8
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
DETAIL B
D
D2
(A3)
Ç
Ç
4
5
A1
8X
A
B
E
E2
8X
b
A
0.10 C
0.05 C
L
C
SEATING
PLANE
EXPOSED Cu
NOTE 3
A B
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
L1
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
Ç Ç É É É É
http://onsemi.com
CASE 488AF−01
8 PIN DFN, 4x4
CONSTRUCTIONS
CONSTRUCTIONS
ISSUE C
MOLD CMPD
DETAIL B
ALTERNATE
DETAIL A
OPTIONAL
18
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
É É Ç Ç
4.30
L
A3
2.39
0.80
PITCH
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. DETAILS A AND B SHOW OPTIONAL
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
CONSTRUCTIONS FOR TERMINALS.
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
2.21
MILLIMETERS
MIN
0.80
0.00
0.25
1.91
2.09
0.20
0.30
−−−
0.20 REF
4.00 BSC
4.00 BSC
0.80 BSC
MAX
DIMENSIONS: MILLIMETERS
1.00
0.05
0.35
2.21
2.39
0.50
0.15
−−−
0.35
8X
0.63
8X
OUTLINE
PACKAGE
NCP3065/D