NCP3066S3BCKGEVB ON Semiconductor, NCP3066S3BCKGEVB Datasheet - Page 19
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NCP3066S3BCKGEVB
Manufacturer Part Number
NCP3066S3BCKGEVB
Description
EVAL BOARD FOR NCP3066S3BCKG
Manufacturer
ON Semiconductor
Specifications of NCP3066S3BCKGEVB
Design Resources
NCP3066 Buck EVB BOM NCP3066S3BCKGEVB Gerber Files NCPBUCK 3A EVB Schematic
Current - Output / Channel
3A
Outputs And Type
1, Non-Isolated
Voltage - Output
3.2V
Features
Brightness Control
Voltage - Input
12 ~ 35 V
Utilized Ic / Part
NCP3066
Silicon Manufacturer
On Semiconductor
Silicon Core Number
NCP3066
Kit Application Type
Power Management - Voltage Regulator
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
NCP3066S3BCKG
Other names
NCP3066S3BCKGEVBOS
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
M
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
http://onsemi.com
M
N
CASE 751−07
X 45
SOIC−8 NB
ISSUE AJ
_
M
19
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_