MAX16821BEVKIT+ Maxim Integrated Products, MAX16821BEVKIT+ Datasheet - Page 22

• Manufacturer Part Number: MAX16821BEVKIT+
• Description: KIT EVAL FOR MAX16821B
• Manufacturer: Maxim Integrated Products

Specifications of MAX16821BEVKIT+

• Current - Output / Channel: 660mA
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 28V
• Features: Dimmable
• Voltage - Input: 7 ~ 24V
• Utilized Ic / Part: MAX16821
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Use the following guidelines to layout the LED driver.
1) Place the IN, V
2) Minimize the area and length of the high-current
3) Place the necessary Schottky diodes that are con-
4) Use separate ground planes on different layers of
5) Run the current-sense lines CSP and CSN very
6) Place the bank of output capacitors close to the load.
7) Distribute the power components evenly across the
8) Provide enough copper area at and around the
9) Use 2oz or thicker copper to keep trace inductances
High-Power Synchronous HBLED
Drivers with Rapid Current Pulsing
22
close to the MAX16821A/MAX16821B/MAX16821C.
switching loops.
nected across the switching MOSFETs very close to
the respective MOSFET.
the PCB for SGND and PGND. Connect both of
these planes together at a single point and make
this connection under the exposed pad of the
MAX16821A/MAX16821B/MAX16821C.
close to each other to minimize the loop area. Run
the sense lines SENSE+ and SENSE- close to each
other. Do not cross these critical signal lines with
power circuitry. Sense the current right at the pads
of the current-sense resistors. The current-sense
signal has a maximum amplitude of 27.5mV. To pre-
vent contamination of this signal from high dv/dt
and high di/dt components and traces, use a
ground plane layer to separate the power traces
from this signal trace.
board for proper heat dissipation.
switching MOSFETs, inductor, and sense resistors
to aid in thermal dissipation.
and resistances to a minimum. Thicker copper con-
ducts heat more effectively, thereby reducing thermal
impedance. Thin copper PCBs compromise efficiency
in applications involving high currents.
______________________________________________________________________________________
CC
, and V
DD
bypass capacitors
PCB Layout
PROCESS: BiCMOS
MAX16821C
MAX16821A
MAX16821B
TOP VIEW
*EP = EXPOSED PAD.
PART
SENSE+
SENSE-
SGND
SGND
V
V
CC
DD
IN
22
23
24
25
26
27
28
21
1
(V
+
SENSE+
DIFFERENTIAL
20
2
SET VALUE
MAX16821C
MAX16821A
MAX16821B
19
3
TQFN
0.60
0.10
0.03
(V)
Pin Configuration
- V
18
4
Chip Information
SENSE-
Selector Guide
17
5
*EP
16
6
)
15
7
DIFFERENTIAL
14
13
12
11
10
AMP GAIN
9
8
(V/V)
I.C.
OUTV
RT/SYNC
EN
MODE
CLKOUT
SGND
20
1
6