NUD4001DEVB ON Semiconductor, NUD4001DEVB Datasheet - Page 8

EVAL BOARD FOR NUD4001D

NUD4001DEVB

Manufacturer Part Number
NUD4001DEVB
Description
EVAL BOARD FOR NUD4001D
Manufacturer
ON Semiconductor
Datasheets

Specifications of NUD4001DEVB

Design Resources
NUD4001 EVB BOM NUD4001DEVB Gerber Files NUD4001 EVB Schematic
Current - Output / Channel
350mA
Outputs And Type
1, Non-Isolated
Voltage - Input
12V
Utilized Ic / Part
NUD4001
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Voltage - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
NUD4001D
Other names
NUD4001DEVBOS
PUBLICATION ORDERING INFORMATION
Thermal Clad is a registered trademark of the Bergquist Company.
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Email: orderlit@onsemi.com
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
7.0
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
M
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
Y
http://onsemi.com
M
N
CASE 751−07
X 45
ISSUE AF
SO−8
_
M
8
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
STYLE 25:
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
DIM
PIN 1. VIN
A
B
C
D
G
H
K
M
N
J
S
2. N/C
3. REXT
4. GND
5. IOUT
6. IOUT
7. IOUT
8. IOUT
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
NUD4001/D
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_

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