NCP5608EVB ON Semiconductor, NCP5608EVB Datasheet

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NCP5608EVB

Manufacturer Part Number
NCP5608EVB
Description
EVAL BOARD FOR NCP5608
Manufacturer
ON Semiconductor
Datasheets

Specifications of NCP5608EVB

Design Resources
NCP5608EVB BOM NCP5608EVB Gerber Files NCP5608EVB Schematic NCP5608 Demo Brd BOM
Current - Output / Channel
500mA
Outputs And Type
8, Non-Isolated
Voltage - Output
4.8 ~ 5.5 V
Features
Brightness Control
Voltage - Input
3.6V
Utilized Ic / Part
NCP5608
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
NCP5608
Other names
NCP5608EVBOS
NCP5608
Multiple LED Charge Pump
Driver
current loop, based on a charge pump multi mode, to drive White
LED. The current mode regulation allows a uniform and
programmable brightness of the LEDs. The chip has been optimized
for small ceramic capacitors, capable to supply up to 2.0 W output
power.
Features
Typical Applications
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 1
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
The NCP5608 is a high efficiency boost converter operating in
Losses
2.7 to 5.5 V Input Voltage Range
Up to 500 mA Output Current
Capable to Drive 8 LED
Multi Mode Charge Pump Based Converter
I2C Serial Link Protocol
Consistent High Efficiency
Independently Block Programmable Output Currents
Programmable 3 or 4 Operating Backlight LED at Zero Extra
Constant Output Current Regulation
Built−in Dimming Function
Tight Automatic LED Current Matching
Thermal Shutdown Protection
Low Battery Return Noise
This is a Pb−Free Device*
LED Display Back Light Control
Keyboard Back Light
High Power Photo Flash
Multiple Displays
1
IREFBK
†For information on tape and reel specifications,
IREFFL
NCP5608MTR2G
CCMP
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
AGND
24 PIN TQFN (4x4)
SDA
SCL
Device
CASE 511AA
MT SUFFIX
1
2
3
4
5
6
ORDERING INFORMATION
A
L
Y
W
G
24
7
PIN CONNECTIONS
http://onsemi.com
23
= Wafer Lot
= Pb−Free Package
= Assembly Location
= Year
= Work Week
8
(Pb−Free)
TQFN24
Package
22
9
Publication Order Number:
21
10
4000 / Tape & Reel
20
11
1
MARKING
DIAGRAM
24
Shipping
19
12
NCP5608/D
ALYW
NCP
5608
18
17
16
15
14
13
G
V
C1P
C1N
LED8
LED7
PGND
OUT

Related parts for NCP5608EVB

NCP5608EVB Summary of contents

Page 1

... High Power Photo Flash • Multiple Displays *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 June, 2006 − Rev. 1 http://onsemi.com 24 PIN TQFN (4x4) ...

Page 2

CC C6 GND 4.7 mF/ 5.6 k 5.6 k MCU 5 4 IREFBK 3 IREFFL 2 GND 7 GND GND NCP5608 Vbat C3 ...

Page 3

C1 16 PVbat 19 24 AVbat BKL−A ANALOG 3 IREFBK CONTROL 2 PWFL−A IREFFL 1 AGND GND Vbat 6 CCMP 5 SCL DIGITAL CONTROL 4 SDA THERMAL SHUTDOWN Figure 2. NCP5608 Block Diagram NCP5608 ...

Page 4

PIN FUNCTION DESCRIPTION Pin Symbol Type 1 AGND GROUND 2 IREFFL OUTPUT, ANALOG 3 IREFBK OUTPUT, ANALOG 4 SDA INPUT, DIGITAL 5 SCL INPUT, DIGITAL 6 CCMP ANALOG, INPUT 7 LED1 INPUT, POWER 8 LED2 INPUT, POWER 9 LED3 INPUT, ...

Page 5

MAXIMUM RATINGS Rating Power Supply Digital Input Voltage Digital Input Current ESD Capability (Note 4) Human Body Model (HBM) Machine Model (MM) QFN24 Package Power Dissipation @ T = +85°C (Note 5) A Thermal Resistance, Junction−to−Air (according to JEDEC/EIA JESD51−12) ...

Page 6

POWER SUPPLY SECTION (Typical values are referenced to T temperature, unless otherwise noted.) Pin Symbol 19 Power Supply bat, AV bat 18 I Continuous DC Current in the Load @ V out 18 Isch Continuous Output Short Circuit ...

Page 7

DC−DC OPERATION The converter is based on a charge pump technique to generate a DC voltage capable to supply the white LED load. The system regulates the current flowing into each LED by means of internal current mirrors associated with ...

Page 8

LOAD CURRENT CALCULATION The load current is derived from the 600 mV reference voltage provided by the internal band gap associated to the external resistor connected across the I pins and GND (see Figure 4). In any case, no voltage ...

Page 9

In order to improve the efficiency of the back light block when three LED only are used, one can disconnect the Table 1. Programming Table Byte Byte # Byte # ...

Page 10

OUTPUT LED PROGRAMMING SEQUENCE Once the maximum output current has been set up by the external resistor (see Load Current Calculation paragraph above), the I2C protocol can be used to dynamically adjust the brightness of the selected block. At this ...

Page 11

The three bytes, defined to program the chip, must be sent during the same transaction as depicted in Figure 6 and Figure 7. Leaving aside the ACK signal, the NCP5608 does not provide any digital feedback. The selected PWRLED−BK or ...

Page 12

TYPICAL OPERATING CHARACTERISTICS out out 100 mA out 4.4 4.2 4.0 3.8 3.6 Vbat (V) Figure 8. Back Light Efficiency ...

Page 13

Vbat = 4 25°C 0 −2 −4 − 100 150 200 250 300 Iout (mA) Figure 12. Power Flash Output Current Tolerance (LED5 to LED8 GND 4.7 mF/ ...

Page 14

Table 4. Recommended Passive Parts Part Ceramic Cap. 1 μF/16 V TDK Ceramic Cap. 4.7 μF/6.3 V TDK Ceramic Cap. 10 μF/6.3 V TDK C5 GND 4.7 mF Vout LED1 LED2 LED3 LED4 LED5 LED6 LED7 LED8 GND GND Figure ...

Page 15

GND +C1 PWR 220 mF/10 V GND VCC SCL SDA 10 9 IREFFL DIGITAL PORT IREFBK GND Z1 GND GND ABBREVIATIONS FB FeedBack POR Power On Reset: internal ...

Page 16

... A B 0.05 C NOTE 3 N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. ...

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