ADP1707-3.3-EVALZ Analog Devices Inc, ADP1707-3.3-EVALZ Datasheet - Page 5

BOARD EVAL FOR ADP1707-3.3

ADP1707-3.3-EVALZ

Manufacturer Part Number
ADP1707-3.3-EVALZ
Description
BOARD EVAL FOR ADP1707-3.3
Manufacturer
Analog Devices Inc
Datasheet

Specifications of ADP1707-3.3-EVALZ

Channels Per Ic
1 - Single
Voltage - Output
3.3V
Current - Output
1A
Voltage - Input
2.5 ~ 5.5V
Regulator Type
Positive Fixed
Operating Temperature
-40°C ~ 125°C
Board Type
Fully Populated
Utilized Ic / Part
ADP1707
Silicon Manufacturer
Analog Devices
Application Sub Type
LDO
Kit Application Type
Power Management - Voltage Regulator
Silicon Core Number
ADP1707
Features
Track Mode
Kit Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN to GND
OUT to GND
EN to GND
SS/ADJ/TRK to GND
SENSE to GND
Storage Temperature Range
Operating Junction Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to +6 V
–0.3 V to IN
–0.3 V to +6 V
–0.3 V to +6 V
–0.3 V to +6 V
–65°C to +150°C
–40°C to +125°C
JEDEC J-STD-020
Rev. 0 | Page 5 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
8-Lead SOIC (Exposed Paddle)
8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
ADP1706/ADP1707/ADP1708
θ
58
66
JA
Unit
°C/W
°C/W

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