EK29 Cirrus Logic Inc, EK29 Datasheet
![EVAL KIT FOR PWR BOOSTER](/photos/9/17/91721/ek29_sml.jpg)
EK29
Manufacturer Part Number
EK29
Description
EVAL KIT FOR PWR BOOSTER
Manufacturer
Cirrus Logic Inc
Series
Apex Precision Power™r
Specifications of EK29
Channels Per Ic
1 - Single
Amplifier Type
Power
Output Type
Single-Ended
Board Type
Bare (Unpopulated)
Utilized Ic / Part
PB51
Product
Amplifier Modules
Description/function
Audio Amplifiers
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Operating Temperature
-
Current - Output / Channel
-
Voltage - Supply, Single/dual (±)
-
-3db Bandwidth
-
Slew Rate
-
Current - Supply (main Ic)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Other names
598-1466
EK29
EK29
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FLYBACK PROTECTION DIODES
output to both +Vs and to the corresponding Isense pin.
The body diodes of the FETs can be destroyed in specific
circumstances because they cannot be turned “off”, and the
SOA of this portion of the structure is smaller than the SOA
of the switch portion.
dead time between pulses. When the FETs are all turned off
by external control, energy stored in the filter and load must
flow through these diodes. Time constants of this discharge
are often orders of magnitude longer than dead time. If this
action was triggered by a fault detection circuit, energy levels
even higher than normal will have been stored because of the
finite response time of the detection circuit.
EVALUATION KIT
evaluation. It accommodates only the straight pin version
of the amplifier. The PC board is also a good starting point
for an application specific layout. Provided items include: PC
board, heatsink rated at 1.3°C/W, socket, thermal washers,
ceramic bypass capacitors and two 0.1 ohm current sense
resistors with heatsinks. The amplifier is sold separately.
Common hardware such as screws, nuts and user’s prefer-
ence for I/O connectors are not provided.
HEATSINKS
this amplifier. Thermal ratings are for optimum mounting in
free air.
HS20
board with screws.
HS27 5.3°C/W
board by soldering.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
Install a low forward drop, high speed diodes from each
In normal operation, these diodes conduct only during the
EK29 is an easy to use engineering platform for prototype
The following heatsinks are mechanically compatible with
The HS20 is designed to be fastened vertically to a PC
The HS27 is designed to be fastened vertically to a PC
1.3°C/W
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AN PB51 REV A DECEMBER 2004 © 2004 Apex Microtechnology Corp.
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hole is drilled and deburred. Requirements for the potential
heatsink or chassis member are flatness of 2 mils per inch in
an area large enough to fit the package.
SOCKET
MS06
mounted directly in a print circuit board. Use a spacer between
the PCB and the heatsink to avoid short circuits.
THERMAL WASHER
TW07
NOTES:
1. Base material is aluminum, 0.002” thick. Do not allow the
2. For optimum thermal transfer, avoid abrasive handling of
3. The dry thermal compound will flow filling header to heatsink
4. Do not store unused thermal washers above 40°C.
5. A new washer must be used for each mounting.
6. Part number TW07 consists of a package of 10 washers.
7. Thermal resistance is 0.1°C/W.
Many other heatsinks can be used with this amplifier if a
Part number MS06 consists of 2 socket strips. These are
washer to touch pins of the amplifier.
washers which can damage their 0.5mil thick layer of thermal
compound with which each side is coated.
voids as soon as the material reached 60°C.
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