DM163022 Microchip Technology, DM163022 Datasheet - Page 18

• Manufacturer Part Number: DM163022
• Description: BOARD DEMO PICDEM-2 PLUS
• Manufacturer: Microchip Technology
• Type: MCUr

Specifications of DM163022

• Contents: Board, CD, Sample Part
• Processor To Be Evaluated: PIC 16 and PIC 18
• Interface Type: RS-232
• Silicon Manufacturer: Microchip
• Core Architecture: PIC
• Core Sub-architecture: PIC16, PIC18
• Silicon Core Number: PIC16F, PIC18F
• Silicon Family Name: PIC16F8xx, PIC18F4xxx
• Rohs Compliant: NA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: PICDEM 2 Plus
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DM163022R; DM163022R

MCP212X Developer’s Daughter Board User’s Guide
FIGURE 2-3:
DS51571A-page 14
Baud Rate Selection
JP1 JP2 JP3
9600 Baud
19200 Baud
38400 Baud
Figure 2-3 shows the conponent layout for the MCP212X Developer’s Daughter Board
and the operation of the JP1, JP2, JP3 and JP4 jumpers. When the jumper is open, the
signal is pulled high. When the jumper is shorted, the signal is pulled to ground. JP1 is
connected to the header’s RA0 signal, JP2 is connected to the header’s RA1 signal,
JP3 is connected to the header’s RC0 signal and JP4 is connected to the header’s RC1
signal. These signals are also connected to the MCP2120’s BAUD and MODE pins.
JP1, JP2, JP3 AND JP4 CONFIGURATIONS
Settings
All Other
115200 Baud
Not Defined
57600 Baud
Note 1:
Mode Selection
This is the firmware operation for
00063 HPC.asm when used w/
the PICDEM™ HPC Explorer
Demo Board.
MCP212X communicates with
DB-9 (PC)
MCP212X communicates with
PIC18F8722
© 2005 Microchip Technology Inc.
(1)